Revision History
8GB eMMC 153ball FBGA PACKAGE
ASFC8G31M-51BIN
Confidential
-1／39-
Rev.1.3 November 2022
Revision Details Date
Rev 1.0 Initial Release
Dec. 2021
Rev 1.1
Corrections in Table.5, 6 & 15
Jan. 2022
Rev 1.2
Product revision "PRV" revised from 0x01 to 0x0A
Apr. 2022
Rev 1.3
Corrections on Enhance Mode Support functions
References updated to JEDEC Spec JESD84-B51
Added Appendix : VCCQ Power-Off Sequence
Nov. 2022
CONTENTS
1 Product Overview ............................................................................................................................................ 5
1.1 Product Description .................................................................................................................................................... 5
1.2 Product Ordering Information .................................................................................................................................. 5
1.3 Key Features ................................................................................................................................................................ 6
2 Package Information ........................................................................................................................................ 7
2.1 Package Dimension ..................................................................................................................................................... 7
2.2 Ball & Signal Assignment ............................................................................................................................................. 8
2.3 Product Architecture ................................................................................................................................................. 10
3 Technical Notes .............................................................................................................................................. 11
3.1 HS400 Interface ......................................................................................................................................................... 11
3.2 Partition Management .............................................................................................................................................. 11
3.2.1 Boot Area Partition and RPMB Area Partition ................................................................................................... 11
3.2.2 User Density ....................................................................................................................................................... 12
3.3 Boot operation .......................................................................................................................................................... 12
3.4 Field Firmware Upgrade (FFU) .................................................................................................................................. 14
3.5 Cache ......................................................................................................................................................................... 14
3.6 Packed Commands .................................................................................................................................................... 14
3.7 Secure Delete ............................................................................................................................................................ 14
3.7.1 Sanitize ............................................................................................................................................................... 14
3.7.2 Secure Erase ....................................................................................................................................................... 14
3.7.3 Secure Trim ........................................................................................................................................................ 14
3.8 High Priority Interrupt (HPI) ...................................................................................................................................... 15
3.9 Device Health ............................................................................................................................................................ 15
3.10 Auto Power Saving Mode ........................................................................................................................................ 15
3.11 Performance ........................................................................................................................................................... 16
4 Register Value ................................................................................................................................................. 17
4.1 OCR Register ............................................................................................................................................................. 17
4.2 CID Register ............................................................................................................................................................... 17
4.2.1 Product name table (In CID Register) ................................................................................................................. 18
4.3 RCA Register .............................................................................................................................................................. 19
4.4 CSD Register .............................................................................................................................................................. 19
ASFC8G31M-51BIN
Confidential
-2／39-
Rev.1.3 November 2022