Material Composition Declaration
Company Name Issue Date: 10/19/2022
Contact Name: Contact Title:
VP Quality
Contact Phone: Contact Email:
yanping.ma@epc-co.com
Part Weight: Type of Product:
Weight
Mass Sum Mass
(mg) (%) (%) (ppm)
Silicon 7440-21-3
9.8134 31.4101 314101
Silicon oxide 7631-86-9
0.0912 0.2919 2919
Silicon nitride 12033-89-5
0.0306 0.0981 981
Gallium nitride 25617-97-4
0.0659 0.2111 2111
Aluminum 7429-90-5
0.1317 0.4216 4216
Aluminum nitride 24304-00-5
0.0140 0.0448 448
Titanium 7440-32-6
0.0026 0.0084 84
Titanium nitride 25583-20-4
0.1258 0.4026 4026
Copper 7440-50-8
0.0022 0.0070 70
Tungsten 7440-33-7
0.0095 0.0303 303
Polyimide
0.1408 0.4508 4508
Titanium 7440-32-6
0.0010 0.0031 31
Copper 7440-50-8
0.0097 0.0309 309
Copper 7440-50-8
0.8115 2.5973 25973
Nickel
7440-02-0 0.0576 0.1844 1844
Tin 7440-31-5
0.2354 0.7533 7533
Silver 7440-22-4
0.0043 0.0138 138
Package Copper 7440-50-8
11.7262 37.5324 375324
Iron 7439-89-6
0.3007 0.9624 9624
Mold Compound
7.0000 22.4051 224051
Tin 7440-31-5
0.6688 2.1406 21406
Sum in total: 31.2430 100.0000 100.0000 1000000
31.2 mg
EPC2302
Efficient Power Conversion (EPC)
Yanping Ma
(310) 615-0280
eGaN FET in FCQFN package
Construction
Element
Substance
CAS No.
If Applicable
Chip
33.3767
Under Bump Metal
0.0340
3.5490
Solder Bump
63.0404
Note:
The substance content disclosed herewith is approximate and is based on engineering calculation. Statements are based on our present
knowledge and may subject to change at any time due to technical requirements and development. EPC may update this document without
notification. Statement may not include information regarding the minute quantities of dopant and metal materials in the electrical devices
contained within the finished product.