For more information contact your TechNexion sales
representative or email sales@technexion.com
www.technexion.com
Specifications
Core System
Processor
Processor speed
Architecture
PMIC
Memory
Storage
Board-to-Board Connector
System on Module
NXP i.MX8M Quad
Up to 1.5GHz
ARM Cortex-A53 + M4
RoHM BD71837
Up to 8GB LPDDR4
16GB eMMC (default)
Edison compatibile connector
PICO 70-pin Hirose connectors
PICO SOM
Video
Vivante GC7000Lite
4K UltraHD HDR 4Kp60
H.265 VP9
MIPI CSI (4 lanes)
Graphic Engine
Video Decode
Camera
Audio
On carrier board
I²S (2 channel)
Audio Codec
Audio Interface
Operation Systems
Linux
Yocto
Android
Standard Support
FCC ID: 2AKZA-QCA9377
IC: 22364-QCA9377
TELEC: 201-180629
EN 55032 / EN 55024
EN 300 328 v2.2.2
EN 301 893 v2.1.1
RCM Compliant
QDID150839 (Bluetooth 4.2)
Compliant with RoHS /
REACH directives
USA
Canada
Japan
European Union
Australia/New Zealand
Bluetooth Logo
Certication
Certication and Compliance
Network LAN
Wi-Fi/Bluetooth
Antenna
RGMII
Qualcomm QCA9377
802.11 a/b/g/n/ac + BT (BR+EDR+BLE)
MHF4 connector
Connectivity
I²S
SDIO
UART
SPI
I²C
PWM
GPIO
RGMII
HDMI
LAN
MIPI CSI
MIPI DSI
PCIe
USB
USB OTG
Signaling
I/O
PICO-IMX8M
The PICO-IMX8M is a System on Module (SOM) based on an NXP i.MX8M Quad core
Cortex-A53™ + M4™ processor clocking up to 1.5GHz.
The PICO-IMX8M operates in commercial and industrial temperature ranges from -40 to
85°C. The on-board Vivante GC7000Lite GPU OpenGL® ES 3.1, OpenGL® 3.0, Vulkan®, Open
CL™ 1.2 yield superb 4K HDR content on HDMI and MIPI-DSI display complementing 2
MIPI-CSI2 camera interfaces.
The PICO-IMX8M is a member of the TechNexion “PICO pin-to-pin” product family,
providing scalable embedded solutions targeting pixel rich and audio applications.
Accelerate your time-to-market and reduce development costs with TechNexion pre-certi-
ed FCC / IC / CE / RCM / TELEC dual-band Wi-Fi 802.11 ac/a/b/g/n, Bluetooth.
Linux, Yocto, Android runtime images and full source code available.
•
•
•
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From
$
57
40 mm
37 mm
Block Diagram
For more information contact your TechNexion sales
representative or email sales@technexion.com
www.technexion.com
2021-08-09 – All specications are subject to change without notice. © TechNexion – All rights reserved worldwide.
Dimensions (units in mm)
PICO System-on-Modules
Environmental and Mechanical
37 x 40 mm / 1⅜ x 1⅝ inch
PICO Compute Module
8 grams
Commercial: 0° to +60°C
Industrial: -40° to +85°C
10 to 90 %
>100 000 Hours
15G half-sine 11 ms duration
1 Grms random 5-500Hz hr/axis
Dimensions
Form Factor
Weight
Temperature
Relative Humidity
MTBF
Shock
Vibration
Power Specications
4.25-5.25 VDC
Depending on Conguration
Power Input
Power Consumption
Order Information
PICO-IMX8Mx-xx-Rxx-Exx-xxxx-xx-xxxx
Processor
Processor Speed
Memory
Storage
Wi-Fi / Bluetooth
NXP i.MX8M Quad
1.3GHz
2GB LPDDR4
1GB LPDDR4
4GB LPDDR4
eMMC other capacity
Description
1.5GHz
eMMC 16GB
-
13
R10
15
R20
E16
R40
EXX
Qualcomm QCA9377 802.11a/b/g/n/ac
(2.4 + 5GHz) + Bluetooth
9377
Commercial Temperature range
(0° to +60°C)(Default)
-
Temperature Range
Custom ID
Industrial Temperature range
(-40° to +85°C)
Custom Part number ID for customized
Software loader and special
component (BOM)
TI
XXXX
Code
IMX8MQ
-
PICO-IMX8M
Certified
Wi-Fi / Bluetooth
PICO 3 x (70-pin Hirose)
NXP i.MX8M Plus
Quad Cortex-A53 + M7
NXP i.MX8M Quad
Arm Cortex-A53 + M4
5V
DC in
ROHM
BD71847
PMIC
I²C
Up to
8GB
LPDDR4
eMMC
SDIO
Certied
WiFi / Bluetooth
UART
I²S
PWMHDMI GPIOSPISDIOPCIe
USB
OTG
USB
MIPI
CSI
1
MIPI
CSI
2
UART
2
UART
1
MIPI
DSI
I²CI²S
RGMII
40.00
37.00
2.25
1.3
1.6
17.7
6.33
35.02
10.23
22.07
31.95
1.47
21.7
38.53
26.4
24.63
34.27
70
70
70
69
2
1
69
69
2
1
2
1
2