For more information contact your TechNexion sales
representative or email sales@technexion.com
www.technexion.com
Specifications
Core System
Processor
Processor Speed
Architecture
Memory
Storage
Board-to-Board Connector
System on Module
NXP i.MX6 Solo
NXP i.MX6 Duallite
NXP i.MX6 Quad
Up to 1GHz
ARM Cortex-A9
Up to 2GB DDR3
16GB eMMC (Default)
MicroSD
PICO 70-pin Hirose connectors
PICO SOM
Video
Vivante GC2000 (Quad)
Vivante GC320 (2D Composition)
Vivante GC355 (Quad)
Vivante GC880 (Solo/DualLite)
1080p30 + D1 (Solo/DualLite)
1080p60 H.264 (Quad)
BP/Dual 720p
MIPI CSI (4 lanes)
Graphic Engine
Video Decode
Video Encode
Camera
Audio
On carrier board
I²S (2 channel)
Audio Codec
Audio Interface
Operation Systems
Linux
Yocto
Android
Ubuntu
Commercial Linux
Standard Support
Extended Support
FCC ID: 2AKZA-QCA9377
IC: 22364-QCA9377
TELEC: 201-180629
EN 300 328 v2.2.2
EN 301 893 v2.1.1
EN 55032 / EN 55024
RCM Compliant
QDID150839 (Bluetooth 4.2)
Compliant with RoHS /
REACH directives
USA
Canada
Japan
European Union
RCM
Bluetooth Logo
Certication
Certication and Compliance
Network LAN
Wi-Fi / Bluetooth
Antenna
RGMII
Qualcomm QCA9377
802.11 a/b/g/n/ac + BT (BR+EDR+BLE)
MHF4 connector (Optional)
Connectivity
SATA
I²S
SDIO
CAN
UART
SPI
I²C
PWM
GPIO
RGMII
HDMI
LVDS
RGB TTL
MIPI CSI
MIPI DSI
PCIe
USB
USB OTG
Signaling
I/O
PICO-IMX6
From
$
36
The PICO-IMX6 is a System on Module (SOM) based on an NXP i.MX6 Solo,
Duallite, or Quad multicore Cortex-A9™ processor clocking up to 1GHz.
The PICO-IMX6 operates in commercial and industrial temperature ranges
from -40 to 85°C. The system's built-in Vivante GC2000 GPU enriches the
multimedia experience on interfaces such as HDMI, RGB TTL, LVDS, and an
MIPI-CSI2 camera interface.
The PICO-IMX6 is a member of the TechNexion “PICO pin-to-pin” product
family, providing scalable solutions with industrial interfaces such as RGMII,
USB, I²S, CAN, UART, SPI, I²C, PWM, GPIO for sensors for IIoT edge devices.
Accelerate your time-to-market and reduce development costs with TechNex-
ion pre-certied FCC / IC / CE / RCM / TELEC dual-band Wi-Fi 802.11
ac/a/b/g/n, Bluetooth.
Linux, Yocto, Android runtime images and full source code available.
•
•
•
•
•
40 mm
37 mm
Block Diagram
For more information contact your TechNexion sales
representative or email sales@technexion.com
www.technexion.com
2021-08-09 – All specications are subject to change without notice. © TechNexion – All rights reserved worldwide.
Dimensions (units in mm)
PICO System-on-Modules
Environmental and Mechanical
37 x 40 mm / 1⅜ x 1⅝ inch
PICO Compute Module
8 grams
Commercial: 0° to +60° C
Extended: -20° to +70° C
Industrial: -40° to +85° C
10 to 90 %
>100 000 Hours
15G half-sine 11 ms duration
1 Grms random 5-500Hz hr/axis
Dimensions
Form Factor
Weight
Temperature
Relative Humidity
MTBF
Shock
Vibration
Power Specications
4.25-5.25 VDC
Depending on Conguration
Power Input
Power Consumption
Temperature Range
Custom ID
NXP i.IM6 Solo
NXP i.MX6 DualLite
1GHz (Default)
800MHz
512 MB DDR3
Qualcomm QCA9377 802.11a/b/g/n/ac
(2.4 + 5GHz) + Bluetooth
Commercial Temperature range
(0° to +60°C)(Default)
Extended Temperature range
(-20° to +70°C)
Industrial Temperature range
(-40° to +85°C)
2GB DDR3
Description
NXP i.MX6 Quad
1GB DDR3
eMMC 16GB
eMMC other capacity
Custom Part number ID for customized
Software loader and special
component (BOM)
MicroSD Cardslot
-
TE
XXXX
TI
Order Information
PICO-IMX6x-xx-Rxx-xxx-xxxx-xx-xxxx
Processor
Processor Speed
Memory
Storage
Wi-Fi / Bluetooth
Code
IMX6S
IMX6U
IMX6Q
08
10
R05
R10
R20
MSD
-
-
9377
E16
EXX
PICO-IMX6
Up to
2GB
DDR3
PICO 3 x (70-pin Hirose)
NXP i.MX8M Plus
Quad Cortex-A53 + M7
NXP i.MX6 Quad
Arm Cortex-A9
PWMGPIOSPISDIOPCIe
USB
OTG
USB
MIPI
CSI
SATA
UART
2
UART
1
CAN
2
CAN
1
MIPI
DSI
HDMI LVDS
RGB
TTL
I²CI²S
5V
DC in
Discrete
Power
Solution
PMIC
RGMII
I²C
MicroSDeMMC
SDIO
OR
Certied
WiFi / Bluetooth
UART
I²S
40.00
37.00
6.33
17.70
35.02
10.23
31.95
1.47
21.7
38.53
26.40
24.63
34.27
22.07
2.25
1.15
1.6
1
2
69
70
1
2
69
70
1
2
69
70
2