For more information contact your TechNexion sales
representative or email sales@technexion.com
www.technexion.com
Specifications
Core System
Processor
Processor speed
Architecture
PMIC
Memory
Storage
Board-to-Board Connector
System on Module
NXP i.MX7 Dual
Up to 1GHz
ARM Cortex-A7 + M4
NXP PF3000
Up to 2GB DDR3L
16GB eMMC (default)
MicroSD Cardslot (optional)
Edison compatibile connector
PICO 70-pin Hirose connectors
PICO System on Module
Video
Image re-sizing / rotation /
overlay and CSC Pixel
Processing Pipeline
MIPI CSI (2 lanes)
Graphic Engine
Camera
Audio
On carrier board
I²S (2 channel)
Audio Codec
Audio Interface
Operation Systems
Linux
Yocto
Android
Ubuntu
Standard Support
FCC ID: 2AKZA-QCA9377
IC: 22364-QCA9377
TELEC: 201-180629
EN 55032 / EN 55024
EN 300 328 v2.2.2
EN 301 893 v2.1.1
RCM
QDID150839 (Bluetooth 4.2)
Compliant with RoHS /
REACH directives
USA
Canada
Japan
European Union
Australia / New Zealand
Bluetooth Logo
Certication
Certication and Compliance
Network LAN
Wi-Fi / Bluetooth
Antenna
RGMII
Qualcomm QCA9377
802.11 a/b/g/n/ac + BT (BR+EDR+BLE)
MHF4 connector
Connectivity
SDIO
CAN
UART
SPI
I²C
PWM
GPIO
RGMII
RGB TTL
MIPI CSI
MIPI DSI
PCIe
USB
USB OTG
I²S
Signaling
I/O
PICO-IMX7
From
$
35
The PICO-IMX7 is a System on Module (SOM) based on an NXP i.MX7 Dual
core Cortex-A7™ + M4™ processor clocking up to 1GHz.
The PICO-IMX7 operates in commercial and extended temperature
ranges from -20 to 70°C, providing industrial interfaces such as RGMII,
USB, I²S, CAN, UART, SPI, I²C, PWM, GPIO with a RGB TTL graphic interface.
The PICO-IMX7 is a member of the TechNexion “PICO pin-to-pin” product
family, targeting low-power consumption embedded applications.
Accelerate your time-to-market and reduce development costs with
TechNexion pre-certied FCC / IC / CE / RCM / TELEC dual-band Wi-Fi
802.11 ac/a/b/g/n, Bluetooth.
Linux, Yocto, Android runtime images and full source code available.
•
•
•
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40 mm
37 mm
Block Diagram
For more information contact your TechNexion sales
representative or email sales@technexion.com
www.technexion.com
2021-08-09 – All specications are subject to change without notice. © TechNexion – All rights reserved worldwide.
Dimensions (units in mm)
PICO System-on-Modules
Environmental and Mechanical
37 x 40 mm / 1⅜ x 1⅝ inch
PICO Compute Module
8 grams
Commercial: 0° to +60° C
Extended: -20° to +70° C
10 to 90 %
>100 000 Hours
15G half-sine 11 ms duration
1 Grms random 5-500Hz hr/axis
Dimensions
Form Factor
Weight
Temperature
Relative Humidity
MTBF
Shock
Vibration
Power Specications
4.25-5.25 VDC
Depending on Conguration
Power Input
Power Consumption
Order Information
PICO-IMX7x-xx-Rxx-xxx-xxxx-xx-xxxx
Processor
Processor Speed
Memory
NXP i.MX7 Dual
800MHz
1GB DDR3L
2GB DDR3L
512MB DDR3L
Description
1.0GHz
Code
IMX7D
08
10
R05
R10
R20
Storage
MicroSD Cardslot
eMMC other capacity
eMMC 16GB
MSD
E16
EXX
Wi-Fi / Bluetooth
Qualcomm QCA9377 802.11a/b/g/n/ac
(2.4 + 5GHz) + Bluetooth
- -
9377
Temperature Range
Commercial Temperature range
(0° to +60°C)(Default)
Extended Temperature range
(-20° to +70°C)
-
TE
Custom ID
Custom Part number ID for customized
Software loader and special
component (BOM)
XXXX
PICO-IMX7
Up to
2GB
DDR3L
PICO 3 x (70-pin Hirose)
NXP i.MX8M Plus
Quad Cortex-A53 + M7
NXP i.MX7 Dual
Arm Cortex-A7 + M4
PWMGPIOSPISDIOPCIe
USB
OTG
USB
MIPI
CSI
UART
2
UART
1
CAN
2
CAN
1
MIPI
DSI
RGB
TTL
I²CI²S
5V
DC in
NXP
PF3000
PMIC
RGMII
I²C
MicroSDeMMC
SDIO
OR
Certied
WiFi / Bluetooth
UART
I²S
40.00
37.00
1.6
2.25
1.3
6.33
17.7
35.02
26.40
24.63
34.27
10.23
22.07
31.95
1.47
21.70
38.53
1
2
69
70
1
2
69
70
1
2
69
70
2