- 1 -
Doc#40AN
0004
.01
Silicon M
icrostructures, Inc. 2001
2017
. All rights reserved
+1(408) 577
-
0100 |
sales@si
-
micro.com
|
www.si
-
micro.com
SMI Packaged Part Handling
Introduction
This application note was created to help customers with best handling practices for prevention
of accidental damage to Silicon Micro-Structures Inc. (SMI) pressure sensors. SMI follows
industry standards such as JEDEC, EIAJ, IPC, RoHS, and REACH when designing and
manufacturing pressure sensors. For more information about these industry standards, please
refer to their corresponding documentation. This application note describes many of the best
methods for handling of SMI sensors, but is not all inclusive. For more information about exact
part being used, please refer to the data sheet of the respective SMI sensor. If there are any
questions about the application of SMI sensors, please contact the SMI sales team (sales@si-
micro.com).
SMI Packaged Parts
A. General Precautions
1. ESD Safety
Like many ceramic and SOIC compliant packages, SMI sensors are susceptible to
Electrostatic Discharge (ESD). Therefore SMI suggests creating a certified
Electrostatic Discharge Protected Area (ESA) when handling SMI sensors. Please use
ESD compliant equipment when testing, using, and moving or handling SMI sensors
to prevent parts from being damaged by ESD. At minimum an ESD band and
grounding surface mat should be used when working with SMI pressure sensors.
Refer to Association Connecting Electronics Industries (IPC) document IPC-A-610 for
details.
2. Package Handling
SMI sensors fit within JEDEC industry footprint standards of wide body SOIC-16,
SOIC-8, and SMI CerDip packages. JEDEC industry standards of handling should be
applied to use of SMI sensors. When using SMI sensors take caution as to not bend
or break sensor leads. Breaking or bending leads can cause inability to use the
sensor. Proper handling will ensure that the sensor gives accurate readings.
For package dimensions, please refer to sensor data sheet for the external
dimensions of the package. Some SMI packages have long ports, for these packages
- 2 -
Doc#40AN
0004
.01
Silicon M
icrostructures, Inc. 2001
2017
. All rights reserved
+1(408) 577
-
0100 |
sales@si
-
micro.com
|
www.si
-
micro.com
do not apply force beyond maximum side load force. For sensor maximum side load
force, please refer to sales team at sales@si-micro.com. For the soldering footprint,
please refer to SMI footprint package App Note (#40AN0005).
3. Shipping Packaging
SMI uses both tubes and reels to ship sensors to customers. All SMI sensors are
shipped with ESD safe packaging material to prevent against ESD. Both tubes and
reels help prevent damage and issues with delivery.
4. Storage Temperatures
SMI sensors should be stored in a dry environment. Storing sensors at temperature
outside of the storage temperature range may cause parts to become damaged. For
the sensor’s storage temperature range, please refer to the respective sensor data
sheet. SMI complies with the industry standard moisture sensitivity level (MSL)
ratings. SMI sensors are compliant with MSL 1 or MSL 3. Please check the data sheet
or the shipped sensor packaging for the appropriate MSL ratings.
B. Operation Recommendations
1. Applied Pressure
SMI sensors are sensitive to overpressure. Therefore applying pressure outside of
the specified sensor range may damage the device. The respective sensor data sheet
lists limits for both proof pressure and burst pressure. Pressure applied directly or
indirectly can affect performance and damage the sensor. Uncontrolled pressure
may flex sensor die beyond burst pressure and cause the sensor die to break.
Caution should always be taken when applying pressure to a sensor as to prevent a
surge in unwanted pressure.
Please refer to the exact product data sheet to determine the appropriate pressure
range for the SMI sensor.
2. Air Quality
SMI parts are specified for clean dry air only. When using SMI parts ensure that the
system does not allow contaminates. Chemical residues from vapors or liquids can
cause contamination. If clean dry air is not used, small particles can accumulate
within sensor. Depending on the material of these contaminates, the overall
performance of the sensor may degrade over time. Debris and large particles can
damage sensor membrane and alter part performance. Please ensure only clean dry
air is used when using SMI pressure sensors to prevent damage and to facilitate
accurate readings. If the use of non-clean dry air is needed, backside pressure may
be applied to certain SMI sensors. Please contact SMI sales team to determine which
sensors can be used in this method.