JK-SMD0805-380L PPTC DEVICES
EditionA1
Part NumberQ/JKTD-6-380
Page No: 1 OF 4
Table1 :DIMENTION(Unit : mm)
Model Marking
A B C D E
Min. Max. Min. Max. Min. Max Min. Min.
JK-SMD0805-380L
K 2.0 2.2 1.2 1.5 0.6 1.6 0.2 0.1
Table2 : PERFORM A NCE R ATINGS:
Model
V
max
(Vdc)
I
max
(A)
I
hold
@25
(A)
I
trip
@25
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
(Ω)
R1
max
(Ω)
JK-SMD0805-380L
6.0
50.0
3.8
7.6
0.8
19.0
2.0
0.003
0.020
Table3:Test Conditons and
Standards
Test Item
Test Condit ons
Accept/Reject Criteria
Initial Resistance
0.003-0.020
Ω
Holding Current
No Trip
T ime to Trip
2.0 S
Trip endurance
No arcing or burning
Operating Temperature
-40
TO 85
Packaging
Bulk ,3000pcs per bag
SHENZHEN JINRUI ELECTRONIC MATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENC E &
INDUSTRY PARK SHANGKENG COMMUNITY GUANLAN STREET B AOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com
K
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
JK-SMD0805-380L PPTC DEVICES
EditionA1
Part NumberQ/JKTD-6-380
Page No: 2 OF 4
Solder ref low conditions
Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
Devices are not designed to be wave soldered to
the bottom side of the board.
Recommended maximum paste thickness is
0.25mm (0.010inch).
Devices can be cleaned using standard industry
methods and solvents.
Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN JINRUI ELECTRONIC MATERIAL CO.,LTD 6 F DISTRICT N O. 3000046 BLDG Hi-Tech SCIE NCE &
INDUSTRY PARK SHANGKENG COMMUNITY GUANLAN STREET B AOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com