JK-SMD0805-350L PPTC DEVICES
Edition：A1
Part Number：Q/JKTD-12-350
Page No: 1 OF 4
Table1 :DIMENTION(Unit : mm)
Model Marking
A B C D E
Min. Max. Min. Max. Min. Max Min. Min.
JK-SMD0805-350L
K 2.0 2.2 1.2 1.5 0.5 1.4 0.2 0.1
Table2 : PERFORM A NCE R ATINGS:
Model
V
max
(Vdc)
I
max
(A)
I
hold
@25℃
(A)
I
trip
@25℃
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
(Ω)
R1
max
(Ω)
JK-SMD0805-350L
12.0
50.0
3.5
7.0
0.8
17.5
2.0
0.003
0.025
Table3:Test Conditons and
Standards
Test Item
Test Condit ons
Accept/Reject Criteria
Initial Resistance
℃
0.003-0.02
Ω
Holding Current
℃
No Trip
T ime to Trip
℃
≤
2.0 S
Trip endurance
No arcing or burning
Operating Temperature
：
-40
℃
TO 85
℃
Packaging
：
Bulk ,3000pcs per bag
SHENZHEN JINRUI EL ECTRON IC MATERIAL CO.,LTD 6 F DISTRICT N O. 3000046 BLDG Hi-Tech SCIENCE &
INDUSTRY PA RK SHANGK ENG COMMUNITY GUANLAN STREET BAOAN SHENZHEN
TEL
：
0755
－
26546327 26584158 FAX
：
0755
－
26546562
Web Site：www.jkpptc.com E-mail:customer@jkpptc.com
K
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
JK-SMD0805-350L PPTC DEVICES
Edition：A1
Part Number：Q/JKTD-12-350
Page No: 2 OF 4
Solder reflow conditions
● Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to
the bottom side of the board.
● Recommended maximum paste thickness is
0.25mm (0.010inch).
● Devices can be cleaned using standard industry
methods and solvents.
● Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN JINRUI EL ECTRON IC MATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tec h SCIENC E &
INDUSTRY PA RK SHANGK ENG COMMUNITY GUANLAN STREET BAOAN SHENZHEN
TEL
：
0755
－
26546327 26584158 FAX
：
0755
－
26546562
Web Site：www.jkpptc.com E-mail:customer@jkpptc.com