JK-SMD0805-175L PPTC DEVICES
Edition:A0
Part Number:Q/JKTD-6-175
Solder reflow c onditions
● Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to
the bottom side of the board.
● Recommended maximum paste thickness is
0.25mm (0.010inch).
● Devices can be cleaned using standard industry
methods and solvents.
● Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN JINRUI ELECT RONIC MATERI AL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUSTRY PARK SHANGK ENG COMMUNITY GUANLAN STREET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Site:www.jkpptc.com E-mail:customer@jkpptc.com