JK-SMD0805-075 PPTC DEVICES
Edition:A0
Part Number:Q/JKTD-6-075
Solder reflow conditions
● Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
●
Devices are not designed to be wave soldered to
the bottom side of the board.
● Recommended maximum paste thickness is
0.25mm (0.010inch).
● Devices can be cleaned using standard industry
methods and solvents.
● Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
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