JK-SMD0805-075 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-6-075
Page No: 1 OF 3
Table1 :DIMENTION(Unit : mm)
Model
Marking
A
B
C
D
E
Min.
Min.
Max.
Min.
Max
Min.
Min.
JK-SMD0805-075
7 2.00 2.20 1.20 1.50 0.40 1.30 0.20 0.10
Table2 : PERFORM A N CE R ATI N GS:
Model
Marking
V
max
(Vdc)
I
max
(A)
I
hold
@25
(A)
I
trip
@25
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
(Ω)
Ri
typ
(Ω)
R1
max
(Ω)
JK-SMD0805-075
7 6.0 40 0.75 1.50 0.60 8.0 0.20 0.090 0.185 0.385
Table3:Test Condi tons and
Standards
Item
Test Conditon
Standard
Initial Resistance
25
0.090
0.385
I
H
25
0.75A
60min
No Trip
Ttrip
25
℃,
8A
6.0V
0.20s
Trip endurance
6V
100A
60min
No arcing or burning
Operating Temperature
-40
TO 85
PackagingBulk ,4000pcs per bag
SHENZHEN JINRUI ELECTRONIC M ATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUS T RY PA RK SHANGKENG COMMUNITY GUANLAN STREET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Marking : Part identification 7=075
JK-SMD0805-075 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-6-075
Page No: 2 OF 3
Solder reflow conditions
Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
Devices are not designed to be wave soldered to
the bottom side of the board.
Recommended maximum paste thickness is
0.25mm (0.010inch).
Devices can be cleaned using standard industry
methods and solvents.
Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN JINRUI ELECTRONIC M ATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUS T RY PA RK SH ANGKENG COMMUNITY GUANLAN STREET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com