JK-SMD0603-300L PPTC DEVICES
Edition：A1
Part Number：Q/JKTD-6-300
Page No: 1 OF 4
Table1 :Dimension(Unit : mm)
Model Marking
A B C D E
Min. Max. Min. Max. Min. Max Min. Min.
JK-SMD0603-300L
E 1.45 1.85 0.65 1.05 0.7 1.4 0.15 0.1
Table2 :Performance Ratings
Model
V
MAX
(Vdc)
I
MAX
(A)
I
H
@25℃
(A)
I
T
@25℃
(A)
P
D
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
MIN
(Ω)
R1
MAX
(Ω)
JK-SMD0603-300L
6.0 50.0 3.0 6.0 0.5 8.0 5.0 0.008 0.04
Table3:Test Conditions and Standards
Test Item
Test Conditions
Accept/Reject Criteria
Initial Resistance
In still air, 25
℃
0.008-0.04
Ω
Holding Current
25
℃
,3.0A, 60min
No Trip
T ime to Trip
25℃, 8.0A
≤5.0 S
Trip endurance
6V, 50.0A, 60min
No arcing or burning
Table4:Thermal Derating Chart-IH (A)
JK-SMD0603-300L
Maximum ambient operating temperature (℃)
-40
-20
0
25
40
50
60
70
85
Hold Current (A)
3.94
3.43
3.17
3.00
2.49
2.14
2.06
1.71
1.20
Trip Current (A)
7.98
6.86
6.34
6.00
4.98
4.28
4.12
3.42
2.40
SHENZHEN JINRUI EL ECTRON IC MATERIAL CO., LT D 6 F DISTRICT NO. 3000046 BLDG Hi-
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E
Terminal pad materials: T in-Plated Nickel-copper
Terminal pad solder ability: Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
JK-SMD0603-300L PPTC DEVICES
Edition：A1
Part Number：Q/JKTD-6-300
Page No: 2 OF 4
Solder reflow conditions
● Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to
the bottom side of the board.
● Recommended maximum paste thickness is
0.25mm (0.010inch).
● Devices can be cleaned using standard industry
methods and solvents.
● Soldering temperature profile meets ROHS
lead-free process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN JINRUI EL ECTRON IC MATERIAL CO., LT D 6 F DISTRICT NO. 3000046 BLDG Hi-
Tech SCIENCE &
INDUSTRY PA RK SHANGKENG COMMUNITY GUANLAN STREET BAOAN SHEN Z HEN
TEL
：
0755
－
26546327 26584158 FAX
：
0755
－
26546562
Web Site：www.jkpptc.com E-mail:customer@jkpptc.com