JK-SMD0603-030 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-6-030
Page No: 1 OF 3
Table1 :DIMENTION(Unit : mm)
Model Marking
A B C D E
Min. Max. Min. Max. Min. Max Min. MAX
JK-SMD0603-030
3 1.45 1.85 0.65 1.05 0.4 0.7 0.15 0.4
Table2 : PERFORM A N CE R ATI N GS:
Model Marking
V
max
(Vdc)
I
max
(A)
I
hold
@25
(A)
I
trip
@25
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
(Ω)
R1
max
(Ω)
JK-SMD0603-030
3
6.0
40
0.30
0.50
8A
0.10
0.300
2.00
Table3:Test Conditons and
Standards
Item
Test Conditon
Standard
Initial Resistance
25
0.300
2.00
I
H
25
0.30A
60min
No Trip
Ttrip
25
8A
0.10S
Trip endurance
6V
40A
60min
No arcing or burning
Operating Temperature
-40
TO 85
Packaging
tape ,5000pcs per bag
SHENZHEN JINRUI ELECTRONIC M ATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUSTRY P ARK S HANG KENG C OMMUNITY G UANLAN STREET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Marking : Part identification 3=030
JK-SMD0603-030 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-6-030
Page No: 2 OF 3
Solder reflow conditions
Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
Devices are not designed to be wave soldered to
the bottom side of the board.
Recommended maximum paste thickness is
0.25mm (0.010inch).
Devices can be cleaned using standard industry
methods and solvents.
Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN JINRUI ELECTRONIC M ATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUSTRY P ARK S HANG KENG C OMMUNITY G UANLAN STREET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com