JK-SMD1210-150 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-12-150
Page No: 1 OF 3
Table1 :DIMENTION(Unit : mm)
Model Marking
A B C D
Min. Max. Min. Max. Min. Max Min.
JK-SMD1210-150
JK
3.00 3.43 2.35 2.80 0.7 1.50 0.25
Table2 : PERFORM A N CE R ATI N GS:
Model
V
max
(Vdc)
I
max
(A)
I
hold
@25
(A)
I
trip
@25
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
(Ω)
Ri
typ
(Ω)
R1
max
(Ω)
JK-SMD1210-150
12 100 1.50 3.00 0.6 8.0 0.50 0.030 0.070 0.110
Table3:Test Conditons and
Standards
Item
Test Conditon
Standard
Initial Resistance
25
I
H
25
1.50A
60min
Ttrip
25
8.0A
Trip endurance
12V
100A
60min
Operating Temperature
-40
TO 85
Packaging
Bulk ,3000pcs per bag
SHENZHEN JINRUI ELECTRONIC M ATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUSTRY P ARK S HANG KENG C OMMUNITY GUA NLAN STREET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Marking : JK=1210(150)
JK-SMD1210-150 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-12-150
Page No: 2 OF 3
Solder reflow conditions
Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
Devices are not
designed to be wave soldered to
the bottom side of the board.
Recommended maximum paste thickness is
0.25mm (0.010inch).
Devices can be cleaned using standard industry
methods and solvents.
Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements
SHENZHEN JINRUI ELECTRONIC M ATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUS T RY PA RK SHAN GK EN G COM M UNI TY GUA N LAN S TREET B AOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com