JK-SMD250L PPTC DEVICES
EditionA0
Part NumberQ/JKTD-16-250
Page No: 1 OF 3
Table1 :DIMENTION(Unit : mm)
Model Marking
A B C D
Min. Max. Min. Max. Min. Max Min.
JK-SMD250L
JK250L 6.73 7.98 4.80 5.44 0.30 1.10 0.30
Table2 : PERFORM A N CE R ATI N GS:
Model
V
max
(Vdc)
I
max
(A)
I
hold
@25
(A)
I
trip
@25
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
(Ω)
Ri
typ
(Ω)
R1
max
(Ω)
JK-SMD250L
16.0
100
2.50
5.00
1.500
8.00
16.0
0.020
0.085
Table3:Test Conditons and
Standards
Item
Test Conditon
Standard
Initial Resistance
25
0.020
0.085
I
H
25
2.50A
60min
No Trip
T
trip
25
8.00A
16.0s
Trip endurance
16V100A1hr
No arcing or burning
Operating Temperature
-40
TO 85
Packaging
Bulk ,2000pcs per bag
SHENZHEN JINRUI ELECTRON IC MAT ERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tec h SCIENCE &
INDUSTRY PARK SHANGKENG COMMUNITY G UANLAN S TREET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Marking : JK250L=2920(250)
JK-SMD250L PPTC DEVICES
EditionA0
Part NumberQ/JKTD-16-250
Page No: 2 OF 3
Solder reflow conditions
Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
Devices are not
designed to be wave soldered to
the bottom side of the board.
Recommended maximum paste thickness is
0.25mm (0.010inch).
Devices can be cleaned using standard industry
methods and solvents.
Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN JINRUI ELECTRON IC MAT ERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tec h SCIENCE &
INDUS T RY PA RK SHAN GK EN G COM M UNI TY GUA N LAN S TREET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com