JK-SMD200L PPTC DEVICES
EditionA0
Part NumberQ/JKTD-16-200
Page No: 1 OF 3
Table1 :DIMENTION(Unit : mm)
Model Marking
A B C D
Min. Max. Min. Max. Min. Max Min.
JK-SMD200L
JK200L 6.73 7.98 4.80 5.44 0.30 1.00 0.30
Table2 : PERFORMAN CE R ATI N GS:
Model
V
max
(Vdc)
I
max
(A)
I
hold
@25
(A)
I
trip
@25
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
)
Ri
typ
(Ω)
R1
max
(Ω)
JK-SMD200L
16.0
100
2.00
4.00
1.500
8.00
4.5
0.020
0.120
Table3:Test Conditons and
Standards
Item
Test Conditon
Standard
Initial Resistance
25
0.020
0.120
I
H
25
2.00A
60min
No Trip
T
trip
25
8.00A
4.5s
Trip endurance
16V
100A
1hr
No arcing or burning
Operating Temperature
-40
TO 85
Packaging
Bulk ,2000pcs per reel
SHENZHEN JINRUI ELEC TRON IC MATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-T ech SCIENCE &
INDUS T RY PA RK S HAN G KEN G COM M UNI TY GUANLAN STREET BAOAN SH ENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Marking : JK200L=2920(200)
JK-SMD200L PPTC DEVICES
EditionA0
Part NumberQ/JKTD-16-200
Page No: 2 OF 3
Solder reflow conditions
Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
Devices are not designed to be wave soldered to
the bottom side of the board.
Recommended maximum paste thickness is
0.25mm (0.010inch).
Devices can be cleaned using standard industry
methods and solvents.
Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN JINRUI ELEC TRON IC MATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUSTRY P ARK SHANGKENG COMMUNITY GUANLAN STREET BAOAN SHENZHE N
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com