JK-SMD1210-700L-12 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-12-700
Page No: 1 OF 4
Table1 :DIMENTION(Unit : mm)
Model Marking
A B C D E
Min. Max. Min. Max. Min. Max Min. Min.
JK-SMD1210-700L-12 JX 3.0 3.43 2.35 2.8 0.5 1.6 0.25 0.1
Table2 : PERFORM A N CE R ATINGS:
Model
V
max
(Vdc)
I
max
(A)
I
hold
@25
(A)
I
trip
@25
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
(Ω)
R1
max
(Ω)
JK-SMD1210-700L-12
12.0
50.0
7.0
14.0
1.0
35.0
2.0
0.001
0.008
Table3:Test Conditons and
Standards
Test Item
Test Condit ons
Accept/Reject Criteria
Initial Resistance
In still air, 25
Holding Current
25
, 7.0A, 60min
T ime to Trip
25
, 35.0A
Trip endurance
12V, 50A, 60min
Operating Temperature
-40
TO 85
Packaging
Bulk ,3000pcs per bag
SHENZHEN J INRUI ELECTRONIC MATE RIAL C O. ,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUSTRY PARK SHANGKENG COMMUNITY GUANLAN ST REET BAOAN SHENZHEN
TEL
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26546327 26584158 FAX
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JX
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
JK-SMD1210-700L-12 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-12-700
Page No: 2 OF 4
Solder reflow conditions
Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
Devices are not designed to be wave soldered to
the bottom side of the board.
Recommended maximum paste thickness is
0.25mm (0.010inch).
Devices can be cleaned using standar
d industry
methods and solvents.
Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN J INRUI ELECTRONIC MATE RIAL C O. ,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENC E &
INDUSTRY PARK SHANGKENG COMMUNITY GUANLAN ST REET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com