JK-SMD1210-200L-12 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-12-200
Page No: 1 OF 4
Table1 :DIMENTION(Unit : mm)
Model Marking
A B C D E
Min. Max. Min. Max. Min. Max Min. Min.
JK-SMD1210-200L-12 JD 3.0 3.43 2.35 2.8 0.3 0.7 0.25 0.1
Table2 : PERFORM A N CE R ATINGS:
Model
V
max
(Vdc)
I
max
(A)
I
hold
@25
(A)
I
trip
@25
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
(Ω)
R1
max
(Ω)
JK-SMD1210-200L-12
12.0
50.0
2.0
4.0
0.8
8.0
3.0
0.006
0.035
Table3:Test Conditons and
Standards
Test Item
Test Condit ons
Accept/Reject Criteria
Initial Resistance
In still air, 25
Holding Current
25
, 2.0A, 60min
T ime to Trip
25
, 8.0A
Trip endurance
12V, 50A, 60min
Operating Temperature
-40
TO 85
Packaging
Bulk ,4000pcs per bag
SHENZHEN J INRUI ELECTRONIC MATE RIAL C O. ,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUSTRY PARK SHANGKENG COMMUNITY GUANLAN ST REET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com
JD
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
JK-SMD1210-200L-12 PPTC DEVICES
EditionA0
Part NumberQ/JKTD-12-200
Page No: 2 OF 4
Solder reflow conditions
Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
Devices are not designed to be wave soldered to
the bottom side of the board.
Recommended maximum paste thickness is
0.25mm (0.010inch).
Devices can be cleaned using standard industry
methods and solvents.
Soldering temprature profile meets RoHs leadfree
process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
SHENZHEN J INRUI ELECTRONIC MATE RIAL C O. ,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENC E &
INDUSTRY PARK SHANGKENG COMMUNITY GUANLAN ST REET BAOAN SHENZHEN
TEL
0755
26546327 26584158 FAX
0755
26546562
Web Sitewww.jkpptc.com E-mail:customer@jkpptc.com