● Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to
the bottom side of the board.
● Recommended maximum paste thickness is
0.25mm (0.010inch).
● Devices can be cleaned using standard industry
methods and solvents.
● Soldering temprature profile meets RoHs leadfree
process.
SHENZHEN JINRUI ELECTRONIC MATERIAL CO.,LTD 6 F DISTRICT NO. 3000046 BLDG Hi-Tech SCIENCE &
INDUSTRY PARK SHANGKENG COMMUNITY GUANLAN STREET BAOAN SHENZHEN
TEL:0755-26546327 26584158 FAX: 0755-26546562
Web Site:www.jkpptc.com E-mail:customer@jkpptc.com