Key Features
Ultra-Fast response for Fast-20 SCSI
35MHz channel bandwidth
Sleep-mode current less than 150µA
— Disconnects terminator from lows
NO external compensation capacitors
Compatible with active negation drivers
Compatible with passive and active terminations
Approved for use with SCSI 1, 2, 3 and
Ultra SCSI
Hot-swap compatible
Pin-for-pin compatible with LX5226, LX5207
and UCC5610
Block Diagrams
+
Current
Biasing
Circuit
Thermal
Limiting
Circuit
24mA Current
Limiting Circuit
Term Power
DATA OUTPUT
PIN DB (0)
1 of 18 Channels
DISCONNECT
V
TERM
1.4V
2.85V
5226_01.eps
1
1
8-Line Plug and Pla
8-Line Plug and Pla
y
y
SCSI T
SCSI T
er
er
minat
minat
or
or
The 18-channel IMP5226 SCSI terminator is part of IMP's family of high-
performance SCSI terminators that deliver true UltraSCSI performance.
The BiCMOS design offers superior performance over first generation
linear regulator/resistor based terminators.
IMP's new architecture employs high-speed adaptive elements for each
channel, thereby providing the fastest response possible - typically
35MHz, which is 100 times faster than the older linear regulator termi-
nator approach. The bandwidth of terminators based on the older
regulator/resistor terminator architecture is limited to 500kHz since a
large output stabilization capacitor is required.
The IMP architecture eliminates the external output compensation
capacitor and the need for transient output capacitors while maintaining
pin compatibility with first generation designs. Reduced component
count is inherent with the IMP5226.
The IMP5226 architecture tolerates marginal system designs. A key
improvement offered by the IMP5226 lies in its ability to insure reliable,
error-free communications even in systems which do not adhere to rec-
ommended SCSI hardware design guidelines, such as improper cable
lengths and impedance. Frequently, this situation is not controlled by the
peripheral or host designer.
The IMP5226 can be placed in a sleep mode with a high logic signal. In
the sleep mode the outputs are in a high impedance state. Quiescent cur-
rent is less than 150µA when disabled.
The IMP5226 is a superior pin-for-pin replacement for the LX5226,
LX5207, UC5601/5602 and the UCC5610.
traPslennahCepyT
1115PMI9ES
2115PMI9ES
5115PMI9ES
1215PMI72ES
8125PMI9ES
9125PMI9ES
5225PMI81ES
6225PMI81ES
1425PMI8DVL/ES
2425PMI8DVL/ES
spe.60t_6225
IMP SCSI Terminators
1
IMP5226
IMP5226
DATACOMMUNICATIONS
2
Pin Configuration
Ordering Information
Absolute Maximum Ratings
1
10T6
9HEAT SINK / GND
8GND
7HEAT SINK / GND
6T5
5T4
4T3
3T2
2T1
1DISCONNECT
14V
TERM
13T9
12T8
11T7
19 T13
20 HEAT SINK / GND
21 HEAT SINK / GND
22 HEAT SINK / GND
DWP Package
23 T14
24 T15
25 T16
26 T17
27 T18
28 GND
15 NC
16 T10
17 T11
18 T12
5226_02a.eps
IMP5226
SOWB-28
10T6
9HEAT SINK / GND
8GND
7HEAT SINK / GND
6T5
5T4
4T3
3T2
2T1
1DISCONNECT
14V
TERM
13T9
12T8
11T7
19 T13
20 HEAT SINK / GND
21 HEAT SINK / GND
22 HEAT SINK / GND
DB Package
23 T14
24 T15
25 T16
26 T17
27 T18
28 GND
15 NC
16 T10
17 T11
18 T12
5226_02b.eps
IMP5226
SSOP-28
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gnaRerutarepmeTe
gakcaP
PWDC6225PM
I0
°
07otC
°
CB
WOScitsalPnip-82
TPWDC6225PMI0° 07otC °CBWOScitsalPnip-82,leeRdnaepaT
BDC6225PMI0° 07otC °CPOSScitsalPnip-82
TBDC6225PMI0° 07otC °CPOSScitsalPnip-82,leeRdnaepaT
3ta.10t_6225
Thermal Data
TermPwr Voltage . . . . . . . . . . . . . . . . . . . . . . . . +7V
Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . 0V to +7V
Operating Junction Temperature . . . . . . . . . . 150
°
C
Storage Temperature Range . . . . . . . . . . . . . . –65°C to 150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . 300
°
C
Note: 1. Exceeding these ratings could cause damage to the device. All
voltages are with respect to Ground. Currents are positive
into, negative out of the specified terminal.
DWP Package
Thermal Resistance Junction-to-Leads, θ
JL
. . . . . . . . 18°C/W
Thermal Resistance Junction-to-Ambient, θ
JA
. . . . . . 40°C/W
DB Package
Thermal Resistance Junction-to-Ambient, θ
JA
. . . . . . 117°C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x θ
JA
).
The θ
JA
numbers are guidelines for the thermal performance of the
device/pc-board system. All of the ambient airflow is assumed.
1
IMP5226
IMP5226
www.ds-imp.com.cn Daily Silver IMP