VOLTAGE RANGE 50 to 1000 Volts
S3A THRU S3M
CURRENT 3.0 Ampere
FEATURES
Plastic package has underwrites laboratory flammability
Classification 94V-0
For surface mounted applications
Low profile package
Built-in strain relief, ideal for automated placement
Glass Passivated chip junction
High temperature soldering:
250℃/10 second at terminals
MECHANICAL DATA
Case: JEDED DO-214AA molded plastic over glass passivated chip
Terminals: Solder plated, Solderable per MIL-STD-750, method 2026
Polarity: Color band denotes cathode end
Weight: 0.007ounce, 0.25 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified
SMB/DO-214AA
SYMBOLS
S3A S3B S3D S3G S3J S3K S3M UNIT
Maximum Repetitive Peak Reverse Voltage
V
RRM 50 100 200 400 600 800 1000 Volts
Maximum RMS Voltage
V
RMS
35 70 140 280 420 560 700 Volts
Maximum DC Blocking Voltage
V
DC
50 100 200 400 600 800 1000 Volts
Maximum Average Forward Rectified Current
at T
L
=100℃ (NOTE 3)
I
(AV)
3.0 Amps
Peak Forward Surge Current
8.3ms single half sine wave superimposed on
rated load (JEDEC method) T
L
=100℃
I
FSM
100 Amps
Maximum Instantaneous Forward Voltage at 3.0A
V
F
1.15 Volts
Maximum DC Reverse Current
at rated DC Blocking Voltage
T
A
= 25℃
I
R
10.0
µA
T
A
= 125℃
250
Typical Reverse Recovery Time (NOTE 1)
T
rr
2.5 µs
Typical junction capacitance (NOTE 2)
C
J
60 pF
Typical Thermal Resistance (NOTE 3)
R
θJL 47
℃/W
R
θJA 13
Operating and Storage Temperature Range
T
J
,T
STG
-55 to +150
℃
Notes:
1. Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, Irr =0.25A
2. Measured at 1.0MHz and applied reverse voltage of 4.0 Volts
3. Thermal resistance from Junction to ambient and from junction to lead mounted on
P.C.B.with 0.3×0.3″(8.0 × 8.0mm) copper pad areas.
Dimensions in inches and (millimeters)
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VOLTAGE RANGE 50 to 1000 Volts
S3A THRU S3M
CURRENT 3.0 Ampere
RATINGS AND CHARACTERISTIC CURVES S3A THRU S3M
F1G.1-FORWARD CURRENT DERATING CURVE
3.5
200
F1G.2-MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
3.0
2.5
100
2.0
1.5
1.0
0.5
0
50 60
70 80
90 100 110 120 130 140
150
160
LEAD TEMPERATURE,(℃)
F1G.3-TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
10
1
100
10
NUMBER OF CYCLES AT 60Hz
F1G.4-TYPICAL REVERSE
CHARACTERISTICS
100
10
10
1.0
1.0
0.1
0.1
0
20 40 60
80 100
0.01
0.6
0.7 0.8 0.9 1.0 1.1 1.2 1.3
PERCENT OF RATED PEAK
REVERSE VOLTAGE,(%)
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
F1G.5-TYPICAL JUNCTION CAPACITANCE
100
F1G.6-TYPICAL TRANSIENT THERMAL IMPEDANCE
100
10
10
1
1
1.0
10
REVRESE VOLTAGE, VOLTS
100
0.1
0.01
0.1 1.0
10 100
T, PULSE DURATION, SEC.
Resistive or Inductive Load
P.C.B MOUNTED on
0.3X0.3″(8.0X8.0mm)
COPPER PAD AREAS
Mounted ON 0.20X0.27″(5X7mm)
COPPER PAD AREAS
T
J
=25
���
f=1MHz
Vsig=50mVp-p
T
J
=25
℃
Pulse Width=300us
1% Duty Cycle
T
J
=25
℃
T
J
=125
℃
T
L
=100℃
8.3ms Single Half Sine-Wave
(JEDEC Method)
JUNCTION CAPACITANCE,(pF) INSTANTANEOUS FORWARD CURRENT, AMPERES
AVERAGE FORWARD CURRENT
AMPERES
PEAK FORWARD SURGE
CURRENT, AMPERES
TRANSIENT THERMAL IMPEDANCE(
℃
/W)
INSTANTANEOUS REVERSE CURRENT,
MICROAMPERES
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