100 S. Roosevelt Avenue, Chandler, AZ 85226

Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com

Page 1 of 2

TC350

™

Plus Laminates

TC350™ Plus laminates are ceramic lled PTFE-based woven glass reinforced

composite materials providing a cost eective, high performance, thermally

enhanced material for the circuit designer. With a thermal conductivity of 1.24W/

mK, this next generation PTFE-based laminate is ideally suited for higher power

microwave and industrial heating applications requiring higher maximum operating

temperatures, low circuit losses, and excellent thermal dissipation within the circuit

board. Additionally, the advanced ller system used enables the composite to

have much improved mechanical drilling performance when compared with other

competitive laminates. This will result in lower manufacturing costs during circuit

board fabrication.

The standard TC350 Plus laminates are oered with a smooth (Rq = 1.0µm)

electrodeposited copper foil cladding to reduce insertion loss and RF heating of

conductors within the circuit. Resistive foil and metal plate options are available upon

request. TC350 Plus laminates are available in thicknesses from 0.010” to 0.060” to

address higher power design needs.

The woven glass reinforcement combined with the high ller content of the laminate

aords excellent dimensional stability. Other key features of the laminate include low

z-axis CTE (38ppm/°C) for excellent plated through hole reliability, low loss tangent

of 0.0017 at 10 GHz to enable low loss designs, low moisture absorption of 0.05%

to ensure stable performance in a range of operating environments, high dielectric

strength of 650 V/mil to ensure good z-axis insulation between conductor layers, and

UL 94 V-0 ammability performance to enable the use of the material in commercial

applications.

TC350 Plus laminates are used in a range of applications including Ampliers,

Combiners, Power Dividers, Couplers, and Filters. Applicable markets range from

Commercial and Consumer to Defense and Aerospace.

Standard Thicknesses Standard Panel Sizes Standard Claddings

0.010” (0.252mm) +/- 0.0007”

0.020” (0.508 mm) +/- 0.0015”

0.030” (0.762 mm) +/- 0.0020”

0.060” (1.524 mm) +/- 0.0030”

*Additional non-standard thicknesses available from 0.010” -

0.060” in increments of 0.005”

12” X 18” (305mm X 457mm)

24” X 18” (610mm X 457mm

*Additional panel sizes available

Reverse Treated Electrodeposited Copper Foil

½ oz. (18μm) SH/SH

1 oz. (35μm) S1/S1

*Additional cladding weights are available

Features and Benets:

High Thermal Conductivity of 1.24

W/(m

• Improved Thermal Dissipation

Enabling Lower Operating

Temperatures for High Power

Applications

Low Loss Tangent of 0.0017 at 10 GHz

• Excellent High Frequency

Performance

Very Low Prole and Thermally Stable

ED Copper Foil (Rq = 1.0 µm)

• Very Low Insertion Loss and

Reduced RF Heat Generation of

Conductors

Advanced Filler Systems

• Improved Drilling Performance

When Compared to Competitive

Materials

Typical Applications:

• High Power RF and Microwave

Power Ampliers

• High Power Ampliers

for Industrial Heating

Applications

• Passive Components such as

Couplers, Filters and Power

Dividers

Data Sheet

*Contact Customer Service or Sales Engineering to inquire about additional available product congurations

100 S. Roosevelt Avenue, Chandler, AZ 85226

Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com

Page 2 of 2

TC350 Plus

Property

Typical Value

(1)

Units Test Conditions Test Method

Electrical Properties

Dielectric Constant, (e

) (process) 3.50 -

23C @ 50% RH 10 GHz

IPC TM-650 2.5.5.5

Dielectric Constant (design) 3.62 C-24/23/50 10 GHz

Microstrip

Dierential Phase

Length

Dissipation Factor (process)

0.0017 - 23C @ 50% RH 10 GHz IPC TM-650 2.5.5.5

Thermal Coecient of Dielectric

Constant

-42 ppm/°C 50°C to 150°C 10 GHz IPC TM-650 2.5.5.5

Volume Resistivity 9.4 x 10

Mohm-cm

C-96/35/90

IPC TM-650

2.5.17.1

Surface Resistivity 3.3 x 10

Mohm C-96/35/90

IPC TM-650

2.5.17.1

Electrical Strength

(dielectric strength)

650 V/mil IPC TM-650 2.5.6.2

Dielectric Breakdown 38.9 kV D-48/50 X/Y direction IPC TM-650 2.5.6

Comparative Tracking Index 0/600 class/volts C-40/23/50

UL-746A,

ASTM D3638

Thermal Properties

Decomposition Temperature (Td) 500 °C 2hrs @ 105°C 5% Weight Loss IPC TM-650 2.3.40

Coecient of Thermal Expansion

10 X

ppm/˚C -55°C to 288°C IPC TM-650 2.4.41

9 Y

38 Z

Thermal Conductivity 1.24 W/(m

K) Z direction ASTM D5470

Mechanical Properties

Copper Peel Strength after

Thermal Stress

0.70

(4.0)

N/mm

(lbs/in)

10s @288°C 35 μm foil IPC TM-650 2.4.8

Flexural Strength

CMD

75.2 (10.9)

64.8 (9.4)

MPa (ksi ) 25°C +/- 3°C ASTM D790

Tensile Strength

CMD

49.0 (7.1)

46.2 (6.7)

MPa (ksi ) 23°C/50RH

ASTM D3039/

D3039-14

Flex Modulus

CMD

7791 (1130)

7171 (1040)

MPa (ksi ) 25°C +/- 3°C

IPC-TM-650 Test

Method 2.4.4

Dimensional Stability

(MD/CMD)

0.05/0.15 mils/inch after etch + bake IPC-TM-650 2.4.39a

Physical Properties

Flammability V-0 - - UL94

Moisture Absorption 0.05 % E1/105 +D48/50 IPC TM-650 2.6.2.1

Density 2.22 g/cm

C-24/23/50 ASTM D792

Specic Heat Capacity 0.80 J/g°C 2 hours at 105°C ASTM E2716

Nasa Outgassing 0.02/<0.01 % TML/CVCM ASTM E595

(1) Typical values are a representation of an average value for the population of the property. For specication values contact Rogers Corp.

The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create any warranties express or

implied, including any warranty of merchantability or tness for a particular purpose or that the results shown on this data sheet will be achieved by a user for a particular

purpose. The user should determine the suitability of Rogers’ circuit materials for each application.