Smaller than a typical e.MMC, ATP 9x10 e.MMC comes in a 153-ball fine pitch ball
grid array (FBGA package).The tiny footprint/package size makes it perfectly
suitable for embedded systems with space constraints. Its low power consumption
will be a major factor in wearable device configuration.
ATP e.MMC is built to meet the tough demands of commercial applications. As a
soldered-down solution, it is secure against constant vibrations. Its commercial
temperature rating means that scenarios from cold -25°C to hot 85°C will not
cause an adverse impact on the device or the data in it.
Compliant with the latest JEDEC e.MMC 5.1 Standard (JESD84-B51), ATP e.MMC
features Command Queuing and Cache Barrier to enhance random read/write
performance; High Speed 200MHz DDR Mode (HS400) for a bandwidth of up to
400 MB/s; Enhanced Strobe in HS400 Mode facilitates faster synchronization
between the host and the e.MMC device; and Field firmware update (FFU) make
end application easier to resolve problems in the far-end field. Secure Write
Protection ensures that only trusted entities can protect or unprotect the
e.MMC device.
It is backward compatible with previous versions (v4.41/v4.5/v5.0), supporting
features such as power-off notifications, packed commands, cache, boot or
replay protected memory block (RPMB) partitions, and high priority interrupt (HPI).
Key Features
• 40% Less Space of Footprint
• Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
• 153-ball FBGA (RoHS compliant, "green package")
• LDPC ECC engine*
• Designed with 3D TLC NAND
* Low-density parity-check error correcting code.
By product support.
e.MMC
Product Line
Flash Type
IC Package
JEDEC Specification
v5.1, HS400
Firmware Based
250 / 135
32 GB
Capacity
*
Sequential Read/Write up to
(MB/s)
**
Reliability MTBF @ 25°C
Dimensions: L x W x H (mm)
Power Loss
Protection Options
Operating Temperature
Certifications
Warranty
Bus Speed Modes
ICC
(Typical RMS in Read/Write) mA
ICCQ
(Typical RMS in Read/Write) mA
Endurance TBW
**
(Max.)
80.5 / 61.5
8.3TB
x1 / x4 / x8
81.5 / 49.5
>2,000,000 hours
9.0 x 10.0 x 0.8
RoHS, REACH
One Year
3D TLC
153-ball FBGA
E600Vc
-25°C to 85°C
Value
Commercial Grade
Performance
Endurance and Reliability
Others
▲: Customization option available on a project basis.
Technologies &
Add-On Services
Value
▲
▲
Life Monitor
Sudden Power-Off
Recovery (SPOR)
Advanced Wear
Leveling
AutoRefresh Dynamic Data
Refresh
Secure Erase
Industrial
Temperature
End-to-End
Data Protection
Auto-Read
Calibration
SiP
Vibration-Proof
BGA Package
Complete
Drive Test
Joint Validation
* Low-density parity-check error correcting code. By product support.
** All performance is collected or measured using ATP proprietary
test environment, without file system overhead.
v1.0 202207
© Copyright 2022 ATP Electronics, Inc. All rights reserved.
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Product spec and its related information are subject to change without advance notice.
Please contact ATP Sales for more information.
Commercial-Grade Configuration for Read-Intensive Applications
ATP 9x10 e.MMC
Embedded Flash Storage Solution
11.5x13 e.MMC
9x10 e.MMC