CONTENTS
1 Product Overview ............................................................................................................................................ 5
1.1 Product Description .................................................................................................................................................... 5
1.2 Product Ordering Information .................................................................................................................................. 5
1.3 Key Features ................................................................................................................................................................ 6
2 Package Information ........................................................................................................................................ 7
2.1 Package Dimension ..................................................................................................................................................... 7
2.2 Ball & Signal Assignment ............................................................................................................................................. 8
2.3 Product Architecture ................................................................................................................................................. 10
3 Technical Notes .............................................................................................................................................. 11
3.1 HS400 Interface ......................................................................................................................................................... 11
3.2 Partition Management .............................................................................................................................................. 11
3.2.1 Boot Area Partition and RPMB Area Partition ................................................................................................... 11
3.2.2 Enhanced Partition (Area) .................................................................................................................................. 12
3.2.3 User Density ....................................................................................................................................................... 12
3.3 Boot operation .......................................................................................................................................................... 12
3.4 Field Firmware Upgrade (FFU) .................................................................................................................................. 14
3.5 Cache ......................................................................................................................................................................... 14
3.6 Packed Commands .................................................................................................................................................... 14
3.7 Secure Delete ............................................................................................................................................................ 14
3.7.1 Sanitize ............................................................................................................................................................... 14
3.7.2 Secure Erase ....................................................................................................................................................... 14
3.7.3 Secure Trim ........................................................................................................................................................ 14
3.8 High Priority Interrupt (HPI) ...................................................................................................................................... 15
3.9 Device Health ............................................................................................................................................................ 15
3.10 Auto Power Saving Mode ........................................................................................................................................ 15
3.11 Enhanced Strobe ..................................................................................................................................................... 16
3.12 Performance ........................................................................................................................................................... 16
4 Register Value ................................................................................................................................................. 17
4.1 OCR Register ............................................................................................................................................................. 17
4.2 CID Register ............................................................................................................................................................... 17
4.2.1 Product name table (In CID Register) ................................................................................................................. 18
4.3 RCA Register .............................................................................................................................................................. 19
4.4 CSD Register .............................................................................................................................................................. 19
Rev.1.0 June 2022
ASFC16G31M-51BIN
Confidential
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