Technical Data Sheet
BERGQUIST GAP PAD TGP HC1000
Known as BERGQUIST GAP PAD HC1000
October -2018
PRODUCT DESCRIPTION
“Gel-Like” Modulus Gap Filling Material.
Technology Silicone
Appearance Gray
Reinforcement Carrier Fiberglass
Thickness 0.254 to 0.508mm , ASTM D374
Inherent Surface Tack 2 (1 sided)
Application Thermal management,
TIM (Thermal Interface Material)
Operating Temperature
Range
-60 to 200ºC
FEATURES AND BENEFITS
● Thermal Conductivity: 1.0 W/m-K
● Highly Conformable, low hardness
● “Gel-like” modulus
● Fiberglass reinforced for puncture, shear and tear
resistance
BERGQUIST GAP PAD TGP HC1000 is an extremely
conformable, low-modulus polymer that acts as a thermal
interface and electrical insulator between electronic
components and heat sinks. The “gel-like” modulus allows this
material to fill air gaps to enhance the thermal performance of
electronic systems.
BERGQUIST GAP PAD TGP HC1000 is offered with
removable protective liners on both sides of the material.
TYPICAL APPLICATIONS
● Computer and peripherals
● Telecommunications
● Heat interfaces to frames, chassis or other heat spreading
devices
● RDRAM™ memory modules / chip scale packages
● CDROM / DVD cooling
● Areas where irregular surfaces need to make a thermal
interface to a heat sink
● DDR SDRAM memory modules
● FBDIMM modules
TYPICAL PROPERTIES OF CURED MATERIAL
Young's modulus is calculated using 0.01 in/min, step rate of
strain with a sample size 0.79 inch².
Physical Properties
Hardness, Shore 00
, Thirty second delay value
, ASTM D2240, Bulk rubber
25
Heat Capacity, ASTM E1269, J/g-K 1.0
Density, Bulk rubber, ASTM D792, g/cc 1.6
Flammability, UL 94 V-0
Young's Modulus, ASTM D575 kPa 275
(psi) (40)
Electrical Properties
Dielectric Breakdown Voltage , ASTM D149, VAC >5,000
Dielectric Constant, ASTM D150, 1,000Hz 5.5
Volume Resistivity, ASTM D257, ohm-meter 1×10
11
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 1.0
Thermal Impedance, 0.020 inch
ASTM D5470, ºC-in
2
/W:
10% Deflection 1.3
20% Deflection 1.0
30% Deflection 0.96
The recorded value includes interfacial thermal resistance.
These values are provided for reference only. Actual
application performance is directly related to the surface
roughness, flatness and pressure applied.
GENERAL INFORMATION
For safe handling information on this product, consult the
Safety Data Sheet, (SDS).
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
TDS BERGQUIST GAP PAD TGP HC1000, October -2018
CONFIGURATIONS AVAILABLE
BERGQUIST GAP PAD TGP HC1000 is available in the
following configurations:
● Sheet form
● Die-Cut parts
● Roll form
Natural tack both sides with fiberglass.
STORAGE
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 25ºC (±3), 50% RH (±10) for a 12 months
shelf life. Material removed from containers may be
contaminated during use. Do not return product to the original
container. Henkel Corporation cannot assume responsibility for
product which has been contaminated or stored under
conditions other than those previously indicated. If additional
information is required, please contact your local Technical
Service Center or Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
psi x 145 = N/mm²
MPa = N/mm²
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. The product
can have a variety of different applications as well as differing application and
working conditions in your environment that are beyond our control. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Belgium NV, Henkel Electronic
Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal ground,
Henkel’s liability will in no event exceed the amount of the concerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. the following
disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Corporation, Resin Technology
Group, Inc., or Henkel Canada Corporation, the following disclaimer is
applicable:
The data contained herein are furnished for information only and are believed to
be reliable. We cannot assume responsibility for the results obtained by others
over whose methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production methods mentioned
herein and to adopt such precautions as may be advisable for the protection of
property and of persons against any hazards that may be involved in the handling
and use thereof. In light of the foregoing, Henkel Corporation specifically
disclaims all warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from sale or use
of Henkel Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages of any kind,
including lost profits. The discussion herein of various processes or
compositions is not to be interpreted as representation that they are free from
domination of patents owned by others or as a license under any Henkel
Corporation patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application before
repetitive use, using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
Trademark usage: [Except as otherwise noted] All trademarks in this document
are trademarks and/or registered trademarks of Henkel and its affiliates in the
U.S. and elsewhere.
Reference 1
Americas
+1.888.943.6535
Europe
+32.1457.5611
Asia
+86.21.3898.4800
For the most direct access to local sales and technical support visit: www.henkel.com/electronics