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Material Content Data Sheet
Sales Product Name BAR 64-05W H6327 Issued 29. August 2013
MA# MA000751162
Package PG-SOT323-3-1 Weight* 5.96 mg
Construction Element Material Group Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip non noble metal arsenic 7440-38-2 0.000 0.00 12
noble metal gold 7440-57-5 0.007 0.12 1153
inorganic material silicon 7440-21-3 0.059 0.98 1.10 9845 11010
leadframe inorganic material silicon 7440-21-3 0.001 0.01 88
non noble metal titanium 7440-32-6 0.003 0.04 441
non noble metal chromium 7440-47-3 0.008 0.13 1322
non noble metal copper 7440-50-8 2.617 43.89 44.07 438788 440639
wire non noble metal copper 7440-50-8 0.004 0.07 0.07 724 724
encapsulation organic material carbon black 1333-86-4 0.031 0.52 5237
plastics epoxy resin - 0.672 11.26 112595
inorganic material silicondioxide 60676-86-0 2.421 40.59 52.37 405866 523698
leadfinish non noble metal tin 7440-31-5 0.133 2.22 2.22 22250 22250
plating noble metal silver 7440-22-4 0.010 0.17 0.17 1679 1679
*deviation < 10% Sum in total: 100,00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com