Material Content Data Sheet

Sales Product Name BAR 64-04W H6327 Issued 29. August 2013

MA# MA000856174

Package PG-SOT323-3-1 Weight* 5.97 mg

Construction Element Material Group Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip non noble metal arsenic 7440-38-2 0.000 0.00 17

noble metal gold 7440-57-5 0.010 0.17 1728

inorganic material silicon 7440-21-3 0.059 0.98 1.15 9840 11585

leadframe inorganic material silicon 7440-21-3 0.001 0.01 88

non noble metal titanium 7440-32-6 0.003 0.04 440

non noble metal chromium 7440-47-3 0.008 0.13 1321

non noble metal copper 7440-50-8 2.617 43.88 44.06 438559 440408

wire non noble metal copper 7440-50-8 0.004 0.07 0.07 723 723

encapsulation organic material carbon black 1333-86-4 0.031 0.52 5234

plastics epoxy resin - 0.671 11.25 112524

inorganic material silicondioxide 60676-86-0 2.420 40.56 52.33 405610 523368

leadfinish non noble metal tin 7440-31-5 0.133 2.22 2.22 22238 22238

plating noble metal silver 7440-22-4 0.010 0.17 0.17 1678 1678

*deviation < 10% Sum in total: 100,00 1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company Infineon Technologies AG

Address 81726 München

Internet www.infineon.com