BZT52C2V4 - BZT52C39
SURFACE MOUNT ZENER DIODE
1 of 3
·
Planar Die Construction
·
500mW Power Dissipation on Ceramic PCB
·
General Purpose, Medium Current
·
Ideally Suited for Automated Assembly
Processes
Features
Maximum Ratings
@ T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage (Note 2) @ I
F
= 10mA
V
F
0.9 V
Power Dissipation (Note 1)
P
d
500 mW
Thermal Resistance, Junction to Ambient Air (Note 1)
R
qJA
305 °C/W
Operating and Storage Temperature Range
T
j,
T
STG
-65 to +150 °C
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm
2
.
2. Short duration test pulse used to minimize self-heating effect.
Mechanical Data
A
B
C
D
E
G
a
H
J
SOD-123
Dim Min Max
A 3.55 3.85
B 2.55 2.85
C 1.40 1.70
D — 1.35
E 0.55 Typical
G 0.25 —
H 0.11 Typical
J — 0.10
a 0° 8°
All Dimensions in mm
·
Case: SOD-123, Plastic
·
UL Flammability Classification Rating 94V-0
·
Moisture Sensitivity: Level 1 per J-STD-020A
·
Terminals: Solderable per MIL-STD-202,
Method 208
·
Polarity: Cathode Band
·
Marking: See Below
·
Weight: 0.01 grams (approx.)
Marking Information
XX
XX = Product Type Marking Code (See Page 2)
2 of 3
Type
Number
Marking
Code
Zener Voltage Range
(Note 2)
Maximum Zener
Impedance (Note 3)
Maximum
Reverse
Current
(Note 2)
Typical
Temperature
Coefficient
@I
ZTC
mV/°C
Test
Current
I
ZTC
V
z
@I
ZT
I
ZT
Z
ZT @
I
ZT
Z
ZK
@I
ZK
I
ZK
I
R
@ V
R
Nom (V) Min (V) Max (V) mA
W
mA uA V Min Max mA
BZT52C2V4
WX 2.4 2.2 2.6 5 100 600 1.0 50 1.0 -3.5 0 5
BZT52C2V7
W1 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0 5
BZT52C3V0
W2 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0 5
BZT52C3V3
W3 3.3 3.1 3.5 5 95 600 1.0 5.0 1.0 -3.5 0 5
BZT52C3V6
W4 3.6 3.4 3.8 5 90 600 1.0 5.0 1.0 -3.5 0 5
BZT52C3V9
W5 3.9 3.7 4.1 5 90 600 1.0 3.0 1.0 -3.5 0 5
BZT52C4V3
W6 4.3 4.0 4.6 5 90 600 1.0 3.0 1.0 -3.5 0 5
BZT52C4V7
W7 4.7 4.4 5.0 5 80 500 1.0 3.0 2.0 -3.5 0.2 5
BZT52C5V1
W8 5.1 4.8 5.4 5 60 480 1.0 2.0 2.0 -2.7 1.2 5
BZT52C5V6
W9 5.6 5.2 6.0 5 40 400 1.0 1.0 2.0 -2 2.5 5
BZT52C6V2
WA 6.2 5.8 6.6 5 10 150 1.0 3.0 4.0 0.4 3.7 5
BZT52C6V8
WB 6.8 6.4 7.2 5 15 80 1.0 2.0 4.0 1.2 4.5 5
BZT52C7V5
WC 7.5 7.0 7.9 5 15 80 1.0 1.0 5.0 2.5 5.3 5
BZT52C8V2
WD 8.2 7.7 8.7 5 15 80 1.0 0.7 5.0 3.2 6.2 5
BZT52C9V1
WE 9.1 8.5 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0 5
BZT52C10
WF 10 9.4 10.6 5 20 150 1.0 0.2 7.0 4.5 8.0 5
BZT52C11
WG 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0 5
BZT52C12
WH 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0 5
BZT52C13
WI 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 5
BZT52C15
WJ 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0 5
BZT52C16
WK 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0 5
BZT52C18
WL 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0 5
BZT52C20
WM 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0 5
BZT52C22
WN 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 20.0 5
BZT52C24
WO 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 22.0 5
BZT52C27
WP 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 25.3 2
BZT52C30
WQ 30 28.0 32.0 2 80 300 0.5 0.1 21.0 24.4 29.4 2
BZT52C33
WR 33 31.0 35.0 2 80 325 0.5 0.1 23.1 27.4 33.4 2
BZT52C36
WS 36 34.0 38.0 2 90 350 0.5 0.1 25.2 30.4 37.4 2
BZT52C39
WT 39 37.0 41.0 2 130 350 0.5 0.1 27.3 33.4 41.2 2
Electrical Characteristics
@ T
A
= 25°C unless otherwise specified
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm
2
.
2. Short duration test pulse used to minimize self-heating effect.
3. f = 1kHz.