Circuit Protection
Power Battery Packs Protection
High I
2
t Fuses
High I
2
t surface mount fuses Compatible
with reflow and wave solder Excellent
environmental integrity
High reliability and resilience
RoHS compliant and Halogen Free
Wide operating temperature range
Strong arc suppression characteristics
Part
Number
2410BP-25A
2410BP-30A
2410BP-40A
Ampere
Rating
(A)
25
30
40
Voltage
Rating
(Vdc)
72
72
63
Interrupting
Rating
72V@500A
72V@500A
63V@500A
Typical Cold
Resistance
(Ohms)
0.0017
0.0012
0.0009
Typical
2
Melting I t
2
(A Sec)
400
900
1600
Typical
Voltage
Drop (V)
0.055
0.050
0.050
DC Cold Resistance are measured at <10% of rated current in ambient temperature of 25 .°C
DC Interrupting Rating - Measured at designated voltage, time constant < 50 microseconds.
2
Typical Melting I t measured at 10In Current.
Typical Voltage Drop measured at rated current after temperature has stabilized.
Specifications
Features
Power battery protection
Test equipmentPower supplies
Game systems Industrial equipment
Telecom system
Appications
2410BP-20A 20 72 72V@500A 0.0023 210 0.060
Amp Rating % of Amp Rating Opening Time
20~40A
100% 4 Hours Min.
200%
< 60 Seconds
Design for power battery packs overload and short circuit protection
Surface mount deign to save space
Ceramic Suqare body with Silver plated end cap
Designed to UL248-1
Fully compatible with lead-free solder and high temperature profile
associated with lead-free assembly
www.prosemitech.com
Descriptions
2410BP Series
Electrical Characteristics
RoHS
2015/863/EC
1
Document Number: P0F0510130201001A
6.2±0.5
(0.244±0.02)
(0.102±0.02)
2.60±0.5
2.60±0.5
(0.102±0.02)
1.40±0.5
(0.055±0.02)
3.0
(0.120)
2.0
(0.08)
(0.125)
3.18
Dimension
Temperature Derating Curve
tP
TP
TL
TS ma x
TS mi n
tS
t
Preheat
Time 2 5 to Pea k°C
Max.Ram p Up Rate= 3 /S
Max.Ram p Down Rate= 6°C/S
°C
25
TC -5°C
Time
Temp e r a tu r e
Soldering Parameters
IR Reflow Profile
Preheat Heat
Temperature min (Tsmin)
Temperature max(Tsmax)
Time (Tsmin to Tsmax) (ts)
150
200°C
60 -120 seconds
°C
Average ramp-up rate
(Tsmax to Tp)
3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
217
60 - 150 seconds
°C
Peak temperature(Tp)
260+0/-5°C
Time within 5°C of actual
peak Temperature (tp)
10 – 30 seconds
Average ramp-down rate
(Tp to Tsmax)
6°C/second max.
Time 25 °C to peak
temperature
8 minutes max.
Wave Soldering:
260°C, 10 seconds max.
Infrared Reflow:
260°C, 30 seconds max.
Ambient Temperature °C
Perc
enta g e o f R at i n g
Unit: mm/inch
Packaging
12mm wide tape on 178mm(7 inch)
diameter reel -specification EIA
Standard 481.
Quantity: 1 000pcs,
Circuit Protection
Power Battery Packs Protection High I
2
t Fuses
Pad layout
www.prosemitech.com
2410BP Series
2
Document Number: P0F0510130201001A
80
85
90
95
100
105
110
115
120
-60 -40 -20 0
20 60
80 100
120
140
40
Normal Operating Temperature: 25℃± 2℃
Operating Temperature: -55℃ to 125℃ with
proper correction factor applied. Chart of
correction factor
Storage Temperature: -55℃ to 125℃
Note: Minimum copper layer thickness = 100um.
Recommend solder thickness is 0.15mm.