MB005S THRU MB10S
REVERSE VOLTAGE: 50 to 1000 VOLTS
FORWARD CURRENT: 0.5 AMPERE
FEATURES
· Glass passivated chip junction MD-S
· Low forward voltage drop
· High surge overload rating of 30 Amperes peak
· Ideal for printed circuit board
· High temperature soldering guaranteed:
260°C for 10 seconds
MECHANICAL DATA
Case: Molded plastic, MD-S
Epoxy: UL 94V-O rate flame retardant
Terminals: Leads solderable per MIL-STD-202,
method 208 guaranteed
Mounting position: Any Weight:
0.008ounce, 0.22gram
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60HZ, resistive or inductive load.
For capacitive load, derate current by 20%.
Symbols
MB005S
MB1S MB2S
MB4S MB6S
MB8S MB10S Units
Maximum Recurrent Peak Reverse Voltage
V
50
100
200
400
600
800
1000
Volts
RRM
Maximum RMS
Voltage
V
35
70
140
280
420
560
700
Volts
RMS
Maximum DC Blocking Voltage
V
50
100
200
400
600
800
1000
Volts
DC
Maximum Average Forward Rectified Current
I
(see Fig. 1)
on glass-epoxy P.C.B (Note 2)
0.5
Amp
(AV)
on aluminum substrate (Note 3)
0.8
Peak Forward Surge Current,
I
8.3ms
single
half-sine-wave
30
Amp
FSM
superimposed on rated load (JEDEC method)
Maximum Forward Voltage
V
F
1.0
Volts
at 0.4A DC and 25
℃
Maximum Reverse Current
at TA=25℃
I
R
5.0
uAmp
at Rated DC Blocking Voltage
T
A
=125
℃
500
Typical
Junction
Capacitance
(Note 1)
C
J
13
pF
Typical
Thermal Resistance (Note 3)
R
70
℃
/W
θJA
Typical
Thermal Resistance (Note 2)
R
20
℃
/W
θJL
Operating and Storage Temperature Range
T
J
，
Tstg
-55 to +150
℃
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads
3- On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad
MB005S THRU MB10S
Characteristic Curves (TA=25
℃
unless otherwise noted)