Material Content Data Sheet

Sales Product Name ESD300-B1-02LRH E6327 Issued 29. August 2013

MA# MA001108592

Package PG-TSLP-2-21 Weight* 0.62 mg

Construction Element Material Group Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip inorganic material silicon 7440-21-3 0.136 21.83 21.83 218306 218306

bumps noble metal silver 7440-22-4 0.000 0.01 92

non noble metal tin 7440-31-5 0.002 0.39 3918

non noble metal copper 7440-50-8 0.005 0.73 1.13 7290 11300

leadframe non noble metal nickel 7440-02-0 0.138 22.18 22.18 221761 221761

encapsulation organic material carbon black 1333-86-4 0.002 0.25 2532

plastics epoxy resin - 0.046 7.34 73431

inorganic material silicondioxide 60676-86-0 0.268 43.05 50.64 430455 506418

leadfinish noble metal gold 7440-57-5 0.010 1.55 1.55 15487 15487

plating noble metal silver 7440-22-4 0.016 2.53 2.53 25290 25290

ubm non noble metal titanium 7440-32-6 0.000 0.02 247

non noble metal tungsten 7440-33-7 0.000 0.01 104

non noble metal copper 7440-50-8 0.001 0.11 0.14 1087 1438

*deviation < 10% Sum in total: 100,00 1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company Infineon Technologies AG

Address 81726 München

Internet www.infineon.com