MSESD5451X
Semiconductor
Compiance
www.msksemi.com
Features
low Capacitance 10pF
Low Clamping Voltage
Small Body Outline Dimensions: 0.039
”
x
0.024
”
(1.0 mm x0.60 mm)
Low Bod
y
Height: 0.019
”
(0.5 mm)
Stand−off Voltage: 5.0V
Low Leakage
Response Time is Typically < 1 ns
IEC61000−4−2 Level 4 ESD Protection for datalines
These are Pb−Free Devices
Applications
10/100/1000 Mbits/s Ethernet
FireWire
Display ports
MDDI ports
Digital Visual Interface (DVI)
Cellular handsets & accessories
Computer and peripherals
Pin Description
Schematic Diagram
DFN1006-2
Electrical Characteristics@ Ta=25℃ unless otherwise
P/N
V
RWM
@I
R
V
BR
@ImA
V
C
@1A
V
C
@I
PP
C
J
V
µA
V
V
V
A
pF
MAX
MIN
MAX
MAX
TYP
MSESD5451X
5
1
5.8
11
15
5
10
Maximum Rating @ Ta=25℃ unless otherwise specified
Symbol
Parameter
Ratings
Units
ESD
IEC 61000-4-2 (HBM-ESD)
Contact
8
KV
Air
15
T
L
Lead Soldering Temperature
260(10sec.)
℃
T
J
Operating Temperature
-55 to +125
℃
T
STG
Storage Temperature
-55 to +150
℃