MSESDxxCI
Semiconductor
Compiance
www.msksemi.com
Mechanical Characteristics
Package: SOD-323
Lead Finish: Matte Tin
Case Material: “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 3 per J-STD-020
Terminal Connections: See Diagram Below
Marking Information: See Below
Applications
USB Ports
Smart Phones
Wireless Systems
Ethernet 10/100/1000 Base T
Features
350W peak pulse power (8/20μs)
Ultra low capacitance ：1.0pF typical
Ultra low leakage：nA level
Low Operating：3.3V,5V,8V,12V,15V,24V
Low clamping voltage
Protects one power line or data line
Complies with following standards:
– IEC 61000-4-2 (ESD) immunity test
Air discharge: ±30kV
Contact discharge: ±30kV
– IEC61000-4-4 (EFT) 40A (5/50ns)
RoHS Compliant
Dimensions and Pin Configuration
Circuit and Pin Schematic
SOD-323
Absolute Maximum Ratings (T
A
=25°C unless otherwise specified)
Parameter
Symbol
Value
Unit
ESD per IEC 61000−4−2 (Air)
ESD per IEC 61000−4−2 (Contact)
VESD
±30
±30
kV
Operating Temperature Range
TJ
−40 to +85
°C
Storage Temperature Range
Tstg
−55 to +150
°C