1N4001 THRU 1N4007
Semiconductor
Compiance
www.msksemi.com
FEATURES
MECHANICAL DATA
Glass passivated device
Ideal for surface mouted applications
Low reverse leakage
Metallurgically bonded construction
High temperature soldering guaranteed:
250 C/10 seconds,0.375”(9.5mm) lead length,
5 lbs. (2.3kg) tension
Case: JEDEC SOD-123FL molded plastic body over passivated chip
Terminals: Solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.0007 ounce, 0.02 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
CMaD
t
DaloCgatalog
Number
SYMBOLS
1N4001
A1
1N4002
A2
1N4003
A3
1N4004
A4
1N4005
A5
1N4006
A6
1N4007
A7
UNITS
Maximum repetitive peak reverse voltage
VRRM
50
100
200
400
600
800
1000
VOLTS
Maximum RMS voltage
V
RMS
35
70
140
280
420
560
700
VOLTS
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
VOLTS
Maximum average forward rectified current
at T
A
=65 C (NOTE 1)
I(AV)
1.0
Amp
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
TL=25 C
I
FSM
25.0
Amps
Maximum instantaneous forward voltage at 1.0A
VF
1.0
Volts
Maximum DC reverse current TA=25 C
at rated DC blocking voltage T
A
=125 C
IR
10.0
50.0
A
Typical junction capacitance (NOTE 2)
C
J
4
pF
Typical thermal resistance (NOTE 3)
RJA
180
K/W
Operating junction and storage temperature range
TJ,TSTG
-55 to +150
C
Note:
1.Averaged over any 20ms period.
2. Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3. Thermal resistance from junction to ambient at 0.375” (9.5mm)lead length,P.C.B. mounted