SS12-MS/SS110-MS
Semiconductor
Compiance
FEATURES
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
250 C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-214AC molded plastic body
Terminals: leads solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.003 ounce, 0.093 grams
0.004 ounce, 0.111 grams SMA(H)
SMA
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
SYMBOLS
SS12
SS13
SS14
SS15
SS16
SS18
SS110
UNITS
Maximum repetitive peak reverse voltage
V
RRM
20
30
40
50
60
80
100
VOLTS
Maximum RMS voltage
V
RMS
14
21
28
35
42
56
70
VOLTS
Maximum DC blocking voltage
VDC
20
30
40
50
60
80
100
VOLTS
Maximum average forward rectified current
at TL(see fig.1)
I(AV)
1.0
Amp
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
I
FSM
40.0
Amps
Maximum instantaneous forward voltage at 1.0A
VF
0.45
0.55
0.70
0.85
Volts
Maximum DC reverse current TA=25 C
at rated DC blocking voltage TA=100 C
I
R
0.5
mA
6.0
5.0
Typical junction capacitance (NOTE 1)
CJ
110
90
pF
Typical thermal resistance (NOTE 2)
RqJA
88.0
C/W
Operating junction temperature range
TJ,
-65 to +125
-65 to +150
C
Storage temperature range
TSTG
-65 to +150
C
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas
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