Plastic-Encapsulate MOSFETS
FEA
TURE
z
High density cell design for Low R
DS
on
z
Voltage controlled small signal switch
z
Rugged and reliable
z High saturation current capability
MOSFET MAXIMUM RATINGS (T
a
= 25°C unless otherw
ise noted)
Symbol Parameter Value
Unit
V
DS
Drain-Source voltage
60 V
I
D
Drain
C
u
rre
nt 300
mA
P
D
Power Diss
ipation 0.15 W
T
J
Junctio
n
T
e
mperature 150
T
stg
Storage Temperature -55-150
R
θJA
Thermal Resistance fromJuncti
on to Ambient 833
/W
z
ESD protected
V
GS
Gate-Source voltage
±20 V
MARKING
Equivalent Circuit
APPLICATION
z
z
Load Switch for Portable Devices
DC/DC Converter
V
(BR)DSS
R
DS(on)
MAX
I
D
60
V
5
Ω
@
10V
300m
A
5.3Ω
@
4.5V
1
2
3
6
5
4
72K
SOT-363
N-channel MOSFET
Paramete
r
Symbol
Test Condition
Min
Typ
Max
Units
Static Chara
cteristics
Drain-Source Breakd
own Voltage V
DS
V
GS
= 0V
, I
D
=2
50µA 60
V
Gate Th
reshold Voltage* V
GS(th)
V
DS
=V
GS
, I
D
=1
mA 1 1.3 2.5
V
Ze
ro Gate Voltage Drain Current I
DSS
V
DS
=48V,V
GS
= 0
V
1 µA
I
GSS1
V
GS
20V, V
DS
= 0V
±10 µA
Gate –Source leaka
ge current
V
GS
= 4.5V, I
D
=200mA
1.1 5.3
Drain-Source On-Resista
nce* R
DS(on)
V
GS
=10V,I
D
=5
00mA
0.9 5
Diode
Forward Voltage V
SD
V
GS
=0V, I
S
=300mA
1.5 V
Recovered ch
arge Q
r
V
GS
=0
V,I
S
=
300mA,V
R
=
25V,
dl
s/dt=-100A/µs
30
nC
Dy
namic Characteristics**
Input Capa
citance C
iss
40 pF
Output Capacitance
C
oss
30 pF
Reverse Tr
ansfer Capacitance C
rss
V
DS
=
10V,V
GS
=0
V,f
=1
MHz
10 pF
Sw
itching Characteristics**
Tu
rn-On Delay Time t
d(on)
10 ns
Tu
rn-Off Delay Time t
d(o
ff)
V
GS
=
10V,V
DD
=
50V,R
G
=5
0,
R
GS=50, RL=250
15 ns
Reverse reco
very Time t
rr
V
GS
=0
V,I
S
=
300mA,V
R
=
25V,
dl
s/dt=-100A/µ
s
30
ns
G
A
TE-SOURC
E ZENER DIODE
Gate-Source Breakd
own Voltage BV
GSO
I
gs
=±1mA (Ope
n Drain) ±21.5
±30 V
Notes :
*Pulse Te
st : Pulse Width 300µs, Duty Cycle 2%.
**These parameters have no way to verify.
MOSFET ELECTRICAL CHARACTERISTICS
a
T =25
unless otherwise specified
1
of
3
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©
All right reserved
Heyuan China Base Electronics Technology Co., Ltd.