Material Content Data Sheet

Sales Product Name 1EDI60N12AF Issued 29. June 2016

MA# MA001280954

Package PG-DSO-8-51 Weight* 80.29 mg

Construction Element Material Group Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip inorganic material silicon 7440-21-3 1.779 2.22 2.22 22159 22159

leadframe inorganic material phosphorus 7723-14-0 0.008 0.01 103

non noble metal zinc 7440-66-6 0.033 0.04 411

non noble metal iron 7439-89-6 0.660 0.82 8218

non noble metal copper 7440-50-8 26.789 33.37 34.24 333675 342407

wire noble metal gold 7440-57-5 0.231 0.29 0.29 2878 2878

encapsulation organic material carbon black 1333-86-4 0.148 0.18 1838

plastics epoxy resin - 4.770 5.94 59419

inorganic material silicondioxide 60676-86-0 44.262 55.13 61.25 551308 612565

leadfinish non noble metal tin 7440-31-5 0.814 1.01 1.01 10137 10137

plating noble metal silver 7440-22-4 0.095 0.12 0.12 1186 1186

glue plastics acrylic resin - 0.153 0.19 1907

noble metal silver 7440-22-4 0.543 0.68 0.87 6761 8668

*deviation < 10% Sum in total: 100.00 1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.

Company Infineon Technologies AG

Address 81726 München

Internet www.infineon.com