Material Content Data Sheet

Sales Product Name 1EDI30J12CP Issued 29. August 2013

MA# MA001056342

Package PG-DSO-19-4 Weight* 581.12 mg

Construction Element Material Group Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip inorganic material silicon 7440-21-3 3.203 0.55 0.55 5512 5512

leadframe inorganic material phosphorus 7723-14-0 0.040 0.01 69

non noble metal zinc 7440-66-6 0.160 0.03 275

non noble metal iron 7439-89-6 3.200 0.55 5506

non noble metal copper 7440-50-8 129.929 22.36 22.95 223586 229436

wire noble metal gold 7440-57-5 0.478 0.08 0.08 822 822

encapsulation organic material carbon black 1333-86-4 1.319 0.23 2269

plastics epoxy resin - 42.642 7.34 73379

inorganic material silicondioxide 60676-86-0 395.648 68.08 75.65 680839 756487

leadfinish non noble metal tin 7440-31-5 3.337 0.57 0.57 5742 5742

plating noble metal silver 7440-22-4 0.174 0.03 0.03 299 299

glue plastics acrylic resin - 0.218 0.04 374

noble metal silver 7440-22-4 0.772 0.13 0.17 1328 1702

*deviation < 10% Sum in total: 100,00 1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company Infineon Technologies AG

Address 81726 München

Internet www.infineon.com