LDS / SMD3 – Laser Direct Structuring
Coilformers and Components
LDS/SMD3 Coilformers
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NORWE Inc.
P.O. Box 25 11
North Canton, OH 44720-0511
United States of America
Telefon +1-330 497-8113
Telefax +1-330 305-0592
E-mail usa@norwe.com
Internet www.norwe.com
NORWE GmbH
Postfach 13 56
51691 Bergneustadt
Paulstraße 5, Pernze
51702 Bergneustadt
Deutschland
Telefon +49 (0) 27 63-807-0
Telefax +49 (0) 27 63-807-77
E-mail verkauf@norwe.de
Internet www.norwe.de
www.norwe.eu
LDS Laser Direct
Structuring
The LDS-method uses special plastic
materials with additives. After a partial
activation by laser conductor layers are
created in a chemical reaction.
NORWE has further developed this
technology by using cross-linked plastic
materials to allow winding on the
plastic without solder-pins.
The advantages are convincing –
downsized components, simplified
connecting technology, lower weight,
optimal coplanarity, through connec-
tion as well as the possibility to pro-
vide smaller and medium-sized series
without expenses for a pinning tech-
nique.
NORWE uses this method amongst
others for SMD-components of the
SMD3-series and already for solutions
to customers’ specifications. Our
specialists will be glad to answer your
q
uestions.
The NORWE LDS-process
Step 1
The components to be laser structured are produced by injection moulding. NORWE uses a plastic material
doped with additives which has specially been developed for laser structuring and cross-linking.
This technology allows the use of high temperatures during the soldering process.
Step 2
The plastic components are activated with a laser beam. This process induces
a chemical reaction at which the metal particles that track form the nuclei for
the subsequent metallization. In addition to the activation the laser creates a
micro-roughened surface in which the copper is firmly anchored during the
metallization. There are practically no limits regarding the width or tracking of
metallized surfaces – even three-dimensional designs, like for the
SMD3- coilformers, are possible.
Step 3
The metallization of the components takes place in current-free copper baths.
The desired thickness of the copper layer can be influenced by changing the
exposure time in the baths. The copper is coated with a nickel layer. A thin
gold finish is created, to ensure best solder properties.
Step 4
The finished components are compatible with conventional winding and soldering processes, as due to
the plastic material used they withstand short-term temperatures of 450–500°C. The gold finish ensures
short solder times in the tin bath. Moreover the coilformers which are mostly SMD-components are reflow
solderable without any restrictions.
Laser