A
CP14-127-10 0919
CP Series
CP14-127-10
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered ‘the
standard’ in the thermoelectric industry. This broad product line of high-performance and
highly reliable TEMs is available in numerous heat pumping capacities, geometric shapes,
and input power ranges. Assembled with Bismuth Telluride semiconductor material and
thermally conductive Aluminum Oxide ceramics, the CP Series is designed for higher
current and large heat-pumping applications.
FEATURES APPLICATIONS
• Precise Temperature Control
• Compact Geometric Sizes
• Reliable Solid-State Operation
• No Sound or Vibration
• Environmentally Friendly
• DC Operation
• RoHS Compliant
• Medical Lasers
• Lab Science Instrumentation
• Clinical Diagnostic Systems
• Photonics Laser Systems
• Electronic Enclosure Cooling
• Food & Beverage Cooling
• Chillers (Liquid Cooling)
TECHNICAL SPECIFICATIONS
Hot Side Temperature (°C)
25
50
Qmax (W)
33.4
36.7
Delta Tmax (°C)
67
75
Imax (Amps)
3.9
3.9
Vmax (Volts)
14.4
16.4
Module Resistance (Ohms)
3.44
3.88
SUFFIX
THICKNESS (PRIOR TO THINNING)
FLATNESS & PARALLELISM
HOT FACE
COLD FACE
LEAD LENGTH
L
0.185”±0.010”
0.002”/0.002”
Lapped
Lapped
4.5”
L1
0.185”±0.001”
0.001”/0.001”
Lapped
Lapped
4.5”
L2
0.185”±0.0005”
0.0005”/0.0005”
Lapped
Lapped
4.5”
ML
0.189”±0.010”
0.002”/0.002��
Metallized
Lapped
4.5”
LM
0.189”±0.010”
0.002”/0.002”
Lapped
Metallized
4.5”
MM
0.193”±0.010”
0.002”/0.002”
Metallized
Metallized
4.5”
SEALING OPTIONS
SUFFIX
SEALANT
COLOR
TEMPERATURE RANGE
DESCRIPTION
RT
RTV
White
-60 to +204 °C
Non-corrosive, silicone adhesive sealant
EP
Epoxy
Black
-55 to +150 °C
Low density syntactic foam epoxy encapsulant
