Ceramic Plate Series CP10-31-08
Thermoelectric Modules
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The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is
considered ‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable
TEMs is available in numerous heat pumping capacities, geometric
shapes, and input power ranges. Assembled with Bismuth Telluride
semiconductor material and thermally conductive Aluminum Oxide
ceramics, the CP Series is designed for higher current and large
heat-pumping applications.
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
ets.sales@lairdtech.com
www.lairdtech.com
FEATURES
• Precise temperature control
• Compact geometric sizes
• Reliable solid state operation
• No sound or vibration
• Environmentally friendly
• DC operation
• RoHS compliant
APPLICATIONS
• Medical lasers
• Lab science instrumentation
• Clinical diagnostics systems
• Photonics laser systems
• Electronic enclosure cooling
• Food & beverage cooling
•
Chillers (liquid cooling)
SPECIFICATIONS
TECHNICAL
Hot Side Temperature (°C)
25°C
50°C
Qmax (Watts)
5.3
5.8
Delta Tmax (°C)
67
75
Imax (Amps) 2.5 2.5
Vmax (Volts)
3.8
4.0
Module Resistance (Ohms)
1.29
1.46
SUFFIX
THICKNESS
(PRIOR TO
TINNING)
FLATNESS &
PARALLELISM
HOT FACE
COLD FACE
LEAD LENGTH
L
0.157”±0.010”
0.0015”/0.0015”
Lapped
Lapped
4.5”
L1
0.157”±0.001”
0.001”/0.001”
Lapped
Lapped
4.5”
L2
0.157”±0.0005”
0.0005”/0.0005”
Lapped
Lapped
4.5”
ML
0.161”±0.010”
0.002”/0.002”
Metallized
Lapped
4.5”
LM 0.161”±0.010” 0.002”/0.002” Lapped Metallized 4.5”
MM
0.165”±0.010”
0.002”/0.002”
Metallized
Metallized
4.5”
SEALING OPTIONS
SUFFIX
SEALANT
COLOR
TEMP RANGE
DESCRIPTION
RT
RTV
White
-60 to 204 °C
Non-corrosive, silicone adhesive
EP Epoxy Black -55 to 150 °C Low density syntactic foam epoxy encapsulant
