OptoTEC™ Series HOT20-31-F2A-0909
Thermoelectric Module
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Note: This product has reached end of production and is available on a
limited basis only. This product series has been replaced with the improved
HiTemp ET Series product offering. Consider using ET20-31-F2A-0909
HiTemp ET Series module as a replacement.
The OptoTEC
TM
Series is a miniature thermoelectric module (TEM).
This product series is primarily used in applications to stabilize the
temperature of sensitive optical components in telecom and
photonics industries.
This product line is available in multiple configurations and surface
finishing options. Assembled with Bismuth Telluride semiconductor
material and thermally conductive Aluminum Oxide ceramics, the
OptoTEC Series is designed for lower current and lower heat-
pumping applications. Custom designs are available to accommodate
metallization, pretinning, ceramic patterns, and solder posts,
however MOQ applies.
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
ets.sales@lairdtech.com
www.lairdtech.com
FEATURES
• Miniature geometric sizes
• Precise temperature control
• Reliable solid state operation
• No sound or vibration
• DC operation
• RoHS compliant
APPLICATIONS
• Laser diodes
• CCD cameras
• Calibration equipment
•
Infrared (IR) sensors
• Pump lasers
• Crystal oscillators
•
Optical transceivers
SPECIFICATIONS
PERFORMANCE
Hot Side Temperature (°C)
25
50
Qmax (Watts)
4.2
4.7
Delta Tmax (°C)
67
77
Imax (Amps)
2.0
2.0
Vmax (Volts)
3.5
4.0
Module resistance (ohms)
1.62
1.82
SUFFIX
THICKNESS
PRIOR TO TINNING
FLATNESS &
PARALLELISM
HOT FACE
COLD FACE
LEAD
LENGTH
11
0.086”± 0.002”
0.0002” / 0.002”
Lapped
Lapped
2.0”
TB
0.086”± 0.0005”
0.0005” / 0.0005”
Lapped
Lapped
2.0”
00
0.098”± 0.005”
NA / NA
Metallized
Metallized
2.0”
22
0.098”± 0.005”
NA / NA
Pre-tinned
Pre-tinned
2.0”
GG
0.098”± 0.005”
NA / NA
AuPlated
AuPlated
2.0”
SEALING OPTIONS
SUFFIX
SEALANT
COLOR
TEMP RANGE
DESCRIPTION
RT
RTV
White
-60 to 204 °C
Non-corrosive, silicone adhesive sealant
EP
Epoxy
Black
-55 to 150 °C
Low density syntactic foam epoxy encapsulant
HOT20-31-F2A-0909
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PERFORMANCE CURVES
MECHANICAL DRAWING
Ceramic Material: 96% Alumina Ceramics
Solder Construction: 271
°C, Proprietary
OPERATING TIPS
• Max operating temperature: 175°C
• Do not exceed Imax or Vmax when operating module
• Reference assembly guidelines for recommended installation
• Solder tinning also available on metallized ceramics
LAIRD-ETS-HOT20-31-F2A-0909-DATA-SHEET-101416
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to
change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies
makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any
specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies
products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished
upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other
marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may
be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.