(0,635 mm) .025"
QSS SERIES
Alignment
Pin
QSS–050–01–F–D–A
QSS–075–01–F–D–A
QSS–025–01–L–D–A
Polarized
Integral metal plane
for power or ground
Blade & Beam
Design
WWW.SAMTEC.COM
Due to technical progress, all designs, specifi cations and components are subject to change without notice.
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?QSS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact: 1.8 A per pin
(1 pin powered per row)
Ground Plane:
23.1 A per ground plane
(1 ground plane powered)
Operating Temp:
-55°C to +125°C
Voltage Rating: 285 VAC
Max Cycles: 100
RoHS Compliant: Ye s
Processing:
Lead–Free Solderable: Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (025-050)
(0,15 mm) .006" max (075)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
(3,63)
.143
02
01
(No. of Positions per Row/25) x
(20,00) .7875 + (10,90) .429
(20,00) .7875
(No. of Positions per Row/25) x
(20,00) .7875 + (1,27) .050
01
02
(7,49)
.295
(0,15)
.006
(0,635)
.025
(7,24)
.285
(0,76)
.030
(0,89)
.035
DIA
(3,56)
.140
DIA
(No. of Positions per Row/25) x
(20,00) .7875 + (5,72) .225
QSS
NO. OF POSITIONS
PER ROW
D
PLATING
OPTION
OTHER
OPTION
–025, –050, –075
(50 total positions per bank)
–F
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–L
= 10µ" (0,25 µm) Gold on Signal Pins
and Ground Plane, Matte Tin on tails
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over 150µ" (3,81 µm)
Ni on Signal Pins in contact area,
10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni
on Ground Plane in contact area, Matte Tin
over 50µ" (1,27 µm) min Ni on all solder tails
01 A
–GP
= Guide Holes
for mating
with QTS-RA
–K
= (8,25 mm)
.325" DIA
Polyimide Film
Pick &
Place Pad
–TR
= Tape and
Reel
F-215
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Board Mates:
QTS
Cable Mates:
SQCD
SPECIFICATIONS
QSS/QTS
5 mm Stack Height
Type Rated @ 3dB Insertion Loss*
Single-Ended Signaling –D 9 GHz / 18 Gbps
Differential Pair Signaling –D 8.5 GHz / 17 Gbps
Differential Pair Signaling –DP 8.5 GHz / 17 Gbps
*Performance data includes effects of a non-optimized PCB.
Performance data for other stack heights and complete test data
available at www.samtec.com?QSS or contact sig@samtec.com
®
HIGH SPEED GROUND PLANE SOCKET
• Board spacing
standoffs
(See SO Series)
OTHER SOLUTIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
ALSO AVAILABLE
(MOQ Required)
• 11 mm & 16 mm
stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifi cations.)
• 30µ" (0,76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
• –LS2 Locking screw hole
for QTS–RA–LS2
Contact Samtec
.