▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MA_prec_e-E06R01

METAL CORE WIRE-WOUND CHIP POWER INDUCTORS

(MCOIL

MA SERIES / MCOIL

MA-Ｈ SERIES)

■PRECAUTIONS

1. Circuit Design

Precautions

◆Operating environment

1. The products described in this specification are intended for use in general electronic equipment,(office supply equipment,

telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical

equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear

control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or

damage. For such uses, contact TAIYO YUDEN Sales Department in advance.

2. PCB Design

Precautions

◆Land pattern design

1. Please refer to a recommended land pattern.

Technical

considerations

◆Land pattern design

Surface Mounting

・ Mounting and soldering conditions should be checked beforehand.

・ Applicable soldering process to this products is reflow soldering only.

3. Considerations for automatic placement

Precautions

◆Adjustment of mounting machine

1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.

2. Mounting and soldering conditions should be checked beforehand.

Technical

considerations

◆Adjustment of mounting machine

1. When installing products, care should be taken not to apply distortion stress as it may deform the products.

4. Soldering

Precautions

◆Reflow soldering

1. Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified.

2. The product shall be used reflow soldering only.

3. Please do not add any stress to a product until it returns in normal temperature after reflow soldering.

◆Lead free soldering

1. When using products with lead free soldering, we request to use them after confirming adhesion, temperature of resistance to soldering

heat, soldering etc sufficiently.

Technical

considerations

◆Reflow soldering

1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently

degrade the reliability of the products.

Recommended reflow condition (Pb free solder)

5. Cleaning

Precautions

◆Cleaning conditions

1. Washing by supersonic waves shall be avoided.

Technical

considerations

◆Cleaning conditions

1. If washed by supersonic waves, the products might be broken.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

i_wound_MA_prec_e-E06R01

6. Handling

Precautions

◆Handling

1. Keep the product away from all magnets and magnetic objects.

◆Breakaway PC boards (splitting along perforations)

1. When splitting the PC board after mounting product, care should be taken not to give any stresses of deflection or twisting to the board.

2. Board separation should not be done manually, but by using the appropriate devices.

◆Mechanical considerations

1. Please do not give the product any excessive mechanical shocks.

2. Please do not add any shock and power to a product in transportation.

◆Pick-up pressure

1. Please do not push to add any pressure to a winding part. Please do not give any shock and push into a ferrite core exposure part.

◆Packing

1. Please avoid accumulation of a packing box as much as possible.

Technical

considerations

◆Handling

1. There is a case that a characteristic varies with magnetic influence.

◆Breakaway PC boards (splitting along perforations)

1. The position of the product on PCBs shall be carefully considered to minimize the stress caused from splitting of the PCBs.

◆Mechanical considerations

1. There is a case to be damaged by a mechanical shock.

2. There is a case to be broken by the handling in transportation.

◆Pick-up pressure

1. Damage and a characteristic can vary with an excessive shock or stress.

◆Packing

1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.

7. Storage conditions

Precautions

◆Storage

1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the

storage area should be controlled.

・ Recommended conditions

Ambient temperature : 0～40℃

Humidity : Below 70% RH

・ The ambient temperature must be kept below 30℃. Even under ideal storage conditions, solderability of products electrodes may

decrease as time passes.

For this reason, product should be used within 6 months from the time of delivery.

In case of storage over 6 months, solderability shall be checked before actual usage.

Technical

considerations

◆Storage

1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes

and deterioration of taping/packaging materials may take place.