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REFOND:WI-E-045 A/3 REV:E/0

TG-*

Contents

1. Description .................................................................................................................................. 3

1.1General Description .................................................................................................................. 3

1.2Features ..................................................................................................................................... 3

► Size(mm): 3. 00×3. 00×2.16mm. (mm): 3. 00×3. 00×2.16mm ................................................... 3

1.3 Application ................................................................................................................................ 3

1.4 Package Dimension ................................................................................................................ 4

1.5Product Parameters ................................................................................................................. 5

1.6 Typical optical characteristics curves .................................................................. 7

2. Packaging ................................................................................................................................. 10

2.1 Packaging Specification ....................................................................................................... 10

2.1.1 Carrier Tape Dimension ...................................................................................... 10

2.1.2 Reel Dimension .................................................................................................... 10

2.1.3 Label Form Specification .................................................................................... 11

2.3 Cardboard Box ....................................................................................................................... 11

2.4 Reliability Test Items And Conditions ........................................................ 12

2.5 Criteria For Judging Damage ...................................................................................... 13

3. SMT Reflow Soldering Instructions SMT ......................................................................... 14

3.1SMT Reflow Soldering Instructions SMT ........................................................................ 14

4. Handling Precautions .............................................................................................. 16

4.1 Handling Precautions ............................................................................................ 16