Supermicro Liquid Cooling Solutions

May 2021

Superior Eectiveness of Liquid Cooling with Proven Deployments at Scale

More advanced data center cooling solutions are required to maintain the optimal

operating conditions for today’s data centers’ smooth and ecient operation. As

the rise of AI and big data requires massive amounts of data processing, heat is a

byproduct of the high processing power.

• Switching from Air Conditioning to More Eective Liquid Cooling Reduces

OPEX by more than 40%

- A Switch from Air Conditioners to Liquid Cooling Technology Saves Energy

- Additional power is saved by reducing system Fan Operation

- 1 Year Average Payback on Facility Investment increases the ROI

• Liquid Cooling Eciency Dramatically Improves the PUE of Data Centers for

High Performance, High Power CPUs, and GPUs

- Liquid is fundamentally more ecient at removing heat by up to 1000X

- Future generations of CPUs and GPUs may require liquid Cooling as air

cooling capacity is exceeded

- The Highest performance and Highest Density servers can be supported,

increasing computing capacity per sq. ft.

• Reduces Costs and Environmental Impact

- Liquid cooling reduces power usage and lowers carbon emissions from fossil

fuel power plants. Reducing the environmental impact of today’s data

centers is becoming a corporate responsibility.

Supermicro’s Rack Integration Services works with customers to architect, design,

build, and test whatever type of liquid cooling is required. Supermicro engineers

work to optimize at the rack level to enable high performance workloads.

Types of Liquid Cooling for your Datacenter that Supermicro Oers:

Direct To Chip – Liquid passes directly

on the surface of a chip and draws heat

away. The liquid is then cooled through

a liquid to liquid heat exchanger, either

contained within the rack or externally.

Immersive Cooling – The entire system

is immersed in a liquid which cools all

components. The warm liquid is then

chilled and brought back into the tank.

Rear Door Heat Exchanger –

The rear door of a rack contains several

fans that draw hot air away from the

servers and cool the air before the air is

returned to the datacenter. The cooling

liquid is then chilled externally to the

door.

Supermicro Liquid Cooling Solutions

Ultra

Supermicro Ultra SuperServers are designed to deliver the highest performance, exibility,

scalability and serviceability to demanding IT environments. 1U and 2U Ultra systems

support dual 3

Gen Intel

Xeon

Scalable processors or 3

Gen AMD EPYC

™

processors,

up to 32 DIMMs of DDR4 memory and with a variety of Ultra Riser options oer built-in

1G, 10G and 25G Ethernet. Multiple high performance NVMe storage congurations are

supported as well as options for SAS/SATA and hybrid NVMe drive bays. A D2C cooler is

mounted on each of the processors within the Ultra system and routed through a CDM

loop to the Liquid Cooling CDU.

Bigtwin

The Supermicro BigTwin represents agship performance for the most demanding

applications and HCI environments. The innovative design supports up to four nodes

in a 2U enclosure with no-compromise support for processors, memory and I/O. Each

node can support dual 3

Gen Intel

Xeon

Scalable processors, up to 20 DIMMs of DDR4

memory/PMEM and up to six high speed NVMe drives. AIOM (superset of OCP 3.0)

networking options include 10GbE, 25GbE, 100GbE and InniBand (200 Gb HDR per port).

Shared power and cooling maximize the resource-savings of the multi-node design. D2C

coolers are mounted on the processors within each BigTwin node and routed through a

CDM loop to the Liquid Cooling CDU.

SUperBlade

A shared cooling, power, and networking infrastructure is key to the high density and server

eciency oered by the SuperBlade. Supermicro’s high performance, density optimized, and

energy-ecient SuperBlade supports up to 20 blade servers in an 8U chassis, with a choice of the 3

Gen Intel

Xeon

Scalable processors or 3

Gen AMD EPYC

™

processors. With advanced networking

options including 200G HDR InniBand, Supermicro’s new generation blade product portfolio has

been designed to optimize the TCO of key criteria for today’s datacenters, e.g. power eciency, node

density and performance. A D2C cooler is mounted on each of the processors within the SuperBlade

system and routed through a CDM loop to the Liquid Cooling CDU.

gpU

Supermicro GPU systems are at the heart of today’s AI and HPC

excitement by combining the fastest processors, memory and GPUs

together in a family of systems for AI/ML, Inferencing and HPC. The

2U or 4U GPU systems support 4 or 8 NVIDIA

A100 GPUs together

with NVLink

and NVSwitch respectively, and are powered by the

Gen Intel

Xeon

Scalable processors or AMD EPYC

™

7003/7002

Series processors, and up to 32 DIMMs of DDR4 memory providing an extremely

compact and powerful AI or HPC system. D2C coolers are mounted on each of the

processors and GPUs within the GPU system and routed through CDM loops to

the Liquid Cooling CDU.