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Supermicro Liquid Cooling Solutions
Ultra
Supermicro Ultra SuperServers are designed to deliver the highest
performance, exibility, scalability and serviceability to demanding IT
environments. 1U and 2U Ultra systems support dual 2nd generation Intel
®
Xeon
®
Scalable processors, up to 24 DIMMs of DDR4 memory and with a
variety of Ultra Riser options oer built-in 1G, 10G and 25G Ethernet. Multiple
high performance NVMe storage congurations are supported as well as
options for SAS/SATA and hybrid NVMe drive bays. A D2C cooler is mounted
on each of the processors within the Ultra system and routed through a CDM
loop to the Liquid Cooling CDU.
GPU
Supermicro GPU systems are at the heart of today’s AI and HPC excitement by
combining the fastest processors, memory and GPUs together in a family of
systems for AI/ML, Inferencing and HPC. The 1U GPU system supports up to 4
NVIDIA
®
Tesla
®
V100 GPUs together with NVLink
®
, the highest 2nd generation
Intel
®
Xeon
®
Scalable processors, and up to 12 DIMMs of DDR4 memory
providing an extremely compact and powerful Learning or HPC system. D2C
coolers are mounted on each of the processors and GPUs within the GPU
system and routed through CDM loops to the Liquid Cooling CDU.
BiGtwin
™
The Supermicro BigTwin
™
represents agship performance for the most
demanding applications and HCI environments. The innovative design
supports up to four nodes in a 2U enclosure with no-compromise support
for processors, memory and I/O. Each node can support dual 2nd generation
Intel
®
Xeon
®
Scalable processors, up to 24 DIMMs of DDR4 memory and up to
six high speed NVMe drives. SIOM networking options include 10GbE, 25GbE,
100GbE and IB. Shared power and cooling maximize the resource-savings of
the multi-node design. D2C coolers are mounted on the processors within
each BigTwin node and routed through a CDM loop to the Liquid Cooling CDU.
twinPro
™
The Supermicro TwinPro
™
architecture is based on the Supermicro proven Twin
technology in 1U and 2U form factors, supporting two or four nodes. Each
node can support dual 2nd generation Intel
®
Xeon
®
Scalable processors, up
to 16 DIMMs of DDR4 memory and hot-swappable 3.5” or 2.5” SAS3/SATA3
storage options. SIOM networking options include 10GbE, 25GbE, 100GbE and
IB. D2C coolers are mounted on the processors within each TwinPro node and
routed through a CDM loop to the Liquid Cooling CDU.