BERGQUIST GAP PAD
®
TGP 10000ULM
HIGH-COMPLIANCE, LOW COMPRESSION STRESS, ULTRA-LOW MODULUS GAP PAD
®
Henkel’s BERGQUIST GAP PAD
®
TGP ULM unites very high thermal conductivity and ultra-low modulus to
address the demands of next-generation telecom and datacom applications. With power densities and thermal
loads increasing while devices continue to reduce in footprint, heat dissipation in combination with low assembly
stress is required for optimal performance and reliability. BERGQUIST GAP PAD TGP ULM is a soft, conforming
pad that provides excellent wet out at the interface even on rough or irregular surfaces, delivering optimized
thermal transfer and minimizing assembly stress. Formulated on a silicone-based resin platform, the materials are
supplied in pre-cut pads with tack on both sides for easy application.
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Chanhassen, MN
United States
...
Key Benefits
• Low assembly stress due to ultra-low modulus of
hardness (Shore , ASTM D and Young’s
Modulus (kPa, ASTM D)
• Excellent conformability to rough or irregular surfaces
• Thorough wet out at the interface for maximized thermal
transfer
• High thermal conductivity of . W/m-K (ASTM D)
• Simplified application and processability; supplied in pre-
cut, custom-sized pads with high tack on both sides
• Ability to use a single pad for multi-height chips and/or
multiple devices
• Room temperature storage
Typical applications
• Telecommunications (routers,
switches and base stations)
• Optical Transceivers
• ASICs and DSPs
PRODUCT PROPERTIES BERGQUIST GAP PAD
®
TGP 10000ULM
Hardness (Shore 000)
Inherent Surface Tack
Thermal Conductivity (W/m-K)
Young’s Modulus (kPa)
Dielectric Breakdown Voltage: 40 mil sample (VAC)
,
Appearance
Gray
GAP PAD