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REFOND:WI-E-045 A/3 REV:E/1
TG-201802060894NP
SPECIFICATION
Mass Product
RF-P**MI32DS-BF-N-Y
REFOND P/N
RF-BWB190DS-DD(JT)
Tel: +86-755-66839118 Fax:+86-755-66839300 E-mail:sales@refond.com Web: www.refond.com PAGE:2
REFOND:WI-E-045 A/3 REV:E/1
TG-201802060894NP
Contents
1. Description .................................................................................................................................. 3
1.1 General Description ................................................................................................................ 3
1.2 Features .................................................................................................................................... 3
1.3 Application ................................................................................................................................ 3
1.4 Package Dimension ................................................................................................................ 4
1.5 Product Parameters ................................................................................................................ 5
1.6 Bin Range Of Forward Voltage and Luminous Flux (IF=20mA) BIN
(IF=20mA)......................................................................................................................................................... 7
1.7 Typical Optical Characteristics Curves ............................................................... 8
2. Packaging ................................................................................................................................. 12
2.1 Packaging Specification ....................................................................................................... 12
2.1.1 Carrier Tape Dimension ...................................................................................... 12
2.1.2 Reel Dimension .................................................................................................... 12
2.1.3 Label Form Specification .................................................................................... 13
2.2 Moisture Resistant Packing ................................................................................................. 13
2.3 Cardboard Box ....................................................................................................................... 14
2.4 Reliability Test Items And Conditions ........................................................ 14
2.5 Criteria For Judging Damage ...................................................................................... 15
3. SMT Reflow Soldering Instructions SMT 流焊说明 ......................................................................... 16
3.1 SMT Reflow Soldering Instructions SMT ....................................................................... 16
4. Handling Precautions .............................................................................................. 18
4.1 Handling Precautions ............................................................................................ 18