0.5WZenerDiode‐ BZX55A*series
0.5W 5mA I
ZT
Silicon Planar Zener diode in bare die form – 1% tolerance, “A” grade
Tight tolerance reverse breakdown voltage
Rev 1.0
07/04/19
Features: Die Dimensions in µm (mils)
I
R
characterized at 125°C
Sharp reverse characteristics
Low reverse current Levels
High reliability gold back metal
330 (12.99)
330 (12.99)
210 (8.27)
CHIP BACKSIDE IS CATHODE
Ordering Information
The following part suffixes apply:
200
(7.87)
210 (8.27)
ANODE
For further information on LAT process flows see below.
www.siliconsupplies.com\quality\bare-die-lot-qualification
“K” - MIL-STD-750 /2073 Visual Inspection
+ MIL-PRF-38534 Class K LAT
LAT = Lot Acceptance Test.
“H” - MIL-STD-750 /2073 Visual Inspection
+ MIL-PRF-38534 Class H LAT
No suffix - MIL-STD-750 /2073 Visual Inspection
Supply Formats: Mechanical Specification
Die Size (Unsawn) 330 x 330
12.99 x 12.99
µm
mils
Default – Die in Waffle Pack (400 per tray capacity)
Anode Pad Size 210 x 210
8.27 x 8.27
µm
mils
Sawn Wafer on Tape – By specific request
Unsawn Wafer – By specific request
Lower precision V
Z
tolerances:
2% - B grade, 5% - C grade
Die Thickness 200
7.87
µm
mils
Top Metal Composition Al
Back Metal Composition Au
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