Tflex™ SF10 Series
Thermal Gap Filler
A18314-00 Tflex SF10 Data Sheet 02-24-2022
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parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
PRODUCT DESCRIPTION
Tflex™ SF10 is an innovative, high performing thermal material in Laird’s gap
filler portfolio. This silicone free material measures 10 W/mk and has excellent
deflection properties which provides minimal pressure on components during
deflection. Very little pressure is required to reach the lowest possible thermal
resistance.
FEATURES AND BENEFITS
Silicone free formulation
Low peak and residual pressure
Excellent surface wetting for low contact resistance
Exceptionally low thermal resistance
No Fiberglass reinforcement
Environmentally friendly solution that meets regulatory requirements
including RoHS and REACH
TYPICAL PROPERTIES
PROPERTIES TYPICAL VALUE TEST METHOD
Construction & Composition Ceramic filled silicone free
thermoplastic
N/A
Grey Visual
Thickness Range 0.5mm – 4mm N/A
Thermal Conductivity 10 W/mk Hot Disk
Density 3.7 g/cc Helium
Pycnometer
Thermal Resistance (1.5mm)
0
1.312 °C–cm2/W (0.203 Cin2/W) ASTM D5470
Temperature Range -40
0
C to 125
0
C Laird Test Method
Hardness Shore 00 (3
second)
41 (1mm-4mm)
70 (0.5mm – 0.75mm)
ASTM D2240
Hardness Shore 00 (30
second)
8 (1mm – 4mm)
50 (0.5mm – 0.75mm)
ASTM D2240
0.33 ASTM E595
0.15 ASTM E595
Dielectric Constant @1MHz
9 ASTM D150
10^14 ASTM D257
V-0 (Pending) UL 94
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